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Salary
≈ $33k – $97k per year (Estimated)
Location
In office (Shanghai)

Confirmed on the employer's own hiring board on Oct 17, 2026. First seen by Alion on Aug 26, 2026.

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Profile match
Biren Technology is a Shanghai semiconductor company founded in 2019 that designs general-purpose graphics processors for artificial intelligence training and inference. Its data centre accelerators are among the main domestic alternatives available to Chinese cloud operators under export restrictions. The company develops its own software stack so the chips can run mainstream deep learning frameworks.

GPGPU SoC 架构师 / Senior SoC Architect

岗位概述

资深 SoC 架构师,负责面向

GPGPU / AI 加速器芯片的 SoC 平台架构定义、关键

IP 选型、代际演进规划、性能建模与系统级技术决策。

该岗位将深度参与从产品需求定义、architecture exploration、IP evaluation、SoC specification、RTL implementation support、verification

strategy 到 silicon bring-up / performance tuning 的完整芯片研发周期。候选人需要具备从 workload、software stack、system architecture 到 SoC microarchitecture 的完整视角,能够在性能、功耗、面积、成本、风险和产品上市时间之间做系统性权衡。

岗位职责

l 负责 GPGPU / AI Accelerator SoC 顶层架构定义,包括

compute subsystem、CPU subsystem、memory subsystem、NoC / interconnect、IO subsystem、security、RAS、power management、debug / trace、boot / firmware 等关键模块规划。

l 主导 SoC 关键 IP 的选型、评估和集成策略,包括 CPU IP、NoC / fabric、PCIe / CXL controller、HBM / GDDR / DDR

memory controller、IOMMU / SMMU、security

IP、RAS IP、power management IP、debug / trace IP 等。

l 建立 IP selection methodology,从 performance、power、area、latency、bandwidth、QoS、coherency、scalability、verification complexity、software ecosystem、vendor support、license cost、integration risk 和长期可演进性等维度进行技术评估。

l 规划 SoC IP roadmap 和平台演进路线,定义不同产品代际之间的 IP 复用、升级、替换和自研策略,支撑未来 2-3 代 GPGPU / AI 芯片产品演进。

l 负责 SoC interconnect 架构设计,包括 AXI / ACE / CHI /

CXL / PCIe / NoC 等协议和互连方案选型,定义带宽规划、QoS 策略、仲裁机制、地址映射、memory ordering、cache coherency 和 deadlock avoidance 方案。

l 负责 memory subsystem 架构定义与优化,包括 HBM / GDDR /

DDR 控制器、cache hierarchy、MMU /

IOMMU、TLB、memory partition、channel interleaving、ECC / RAS、memory virtualization、page migration 等关键机制。

l 针对 AI training / inference、HPC、graphics、cloud GPU、multi-tenant

GPU 等 workload 进行性能建模、trace

analysis 和瓶颈分析,指导 NoC、cache、memory bandwidth、DMA engine、command processor、scheduler 和 IO bandwidth 等架构参数优化。

l 负责每一代 GPGPU SoC 的架构演进分析,包括 process node、HBM generation、PCIe / CXL generation、NoC topology、cache hierarchy、memory capacity / bandwidth、chiplet

partition、die-to-die interconnect、power delivery、RAS 和

virtualization capability 等方向。

l 与 GPU Core、Compiler、Driver、Runtime、Firmware、RTL、Verification、Physical Design、Packaging、Board、System

Software 和 Product 团队紧密协作,确保架构方案可实现、可验证、可调优、可量产。

l 与外部 IP vendor、EDA vendor 和生态伙伴协作,完成 IP technical assessment、interface

requirement definition、integration risk review、performance target alignment 和 bring-up

issue closure。

l 定义 SoC 级低功耗和功耗管理架构,包括 clock / power domain 划分、DVFS、power gating、thermal

throttling、power telemetry、power

capping 和 performance per watt 优化策略。

l 参与芯片 bring-up、性能调优和量产问题定位,基于 silicon data、profiling data、validation feedback、customer workload 和上一代产品 lessons learned,推动下一代 SoC 架构改进。

l 输出高质量架构文档和规格,包括 SoC architecture spec、IP selection report、IP roadmap、memory map、interface spec、QoS spec、performance model report、power management

spec、RAS spec、virtualization

spec 等。

任职要求

l 电子工程、计算机体系结构、微电子、计算机科学等相关专业本科及以上学历,硕士或博士优先。

l 8 年以上 SoC / GPU / AI Accelerator / CPU / DPU

/ NPU / Network Processor / High-performance ASIC 架构、设计或系统分析经验,具备复杂芯片量产经验者优先。

l 深入理解复杂 SoC 架构,包括 interconnect、memory subsystem、cache coherency、DMA、interrupt、virtualization、security、boot flow、power

management、debug / trace、RAS 等。

l 熟悉 AMBA 协议体系,如 AXI / ACE / CHI; 熟悉 PCIe、CXL、CCIX、NVLink、Infinity Fabric、UCIe 或类似高速互连 / die-to-die interconnect 者优先。

l 熟悉 GPGPU / AI accelerator 架构,理解 SIMT / SIMD、warp / wavefront、cache hierarchy、shared memory、tensor core / matrix engine、command processor、scheduler、memory coalescing 等概念。

l 具备关键 SoC IP 选型、供应商评估、技术谈判或 IP 集成经验,理解 commercial IP 与 in-house IP 在性能、风险、成本、可控性、验证复杂度和长期演进上的取舍。

l 熟悉主流 SoC IP 生态,包括 ARM / RISC-V CPU、Arteris / ARM CMN / Synopsys NoC、Synopsys /

Cadence / Rambus memory controller、PCIe / CXL

controller、IOMMU / SMMU、security

IP、debug / trace IP 等。

l 熟悉 HBM / GDDR / DDR memory system,理解 memory

bandwidth、latency、bank conflict、channel interleaving、page policy、ECC / RAS、memory protection 和 memory virtualization 等机制。

l 具备扎实的性能分析和建模能力,能够使用 C++ / Python / SystemC / gem5 / proprietary simulator 等进行 architecture modeling、traffic modeling、trace analysis、performance projection 和 design space exploration。

l 理解 GPU 软件栈和系统软件对 SoC 架构的影响,包括 driver、runtime、firmware、compiler、OS kernel、IOMMU、virtual memory、scheduling、telemetry 和 debug infrastructure。

l 具备跨团队技术推动和架构决策能力,能够在架构、RTL、验证、软件、后端、封装、产品和外部 IP vendor 之间推动复杂技术问题闭环。

l 具备优秀的中英文技术沟通和文档能力,能够输出清晰、严谨、可执行的架构规格和技术决策文档。

加分项

l 有GPGPU公司相关工作经验。

l 参与过 Data Center GPU、AI Training / Inference

Accelerator、HPC Accelerator、High-end

SoC、DPU、NPU、Chiplet 或 2.5D / 3D 封装产品架构定义。

l 熟悉 GPU software ecosystem,包括 CUDA、ROCm、OpenCL、Vulkan、DirectX、MLIR、TVM、XLA、PyTorch backend、Triton

等。

l 熟悉云端 GPU 虚拟化和资源隔离场景,包括 SR-IOV、MIG-like partition、IOMMU、ATS / PRI / PASID、memory isolation、QoS isolation、secure multi-tenancy 等。

l 熟悉 Chiplet、HBM integration、UCIe、BoW、AIB、die-to-die interconnect、advanced packaging、interposer 和 silicon interposer / organic

substrate 相关架构约束。

l 熟悉 RAS / Safety / Security 架构,包括 ECC、parity、poison、retry、scrubbing、secure boot、root of trust、TEE、firewall、memory encryption、attestation 等。

l 有从前一代产品 silicon data / customer workload / profiling data 反推下一代 SoC 架构演进的经验。

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