Senior Hardware Electronic Engineer

The Bosch Group is a leading global supplier of technology and services. Since the beginning of 2013, its operations have been divided into four business sectors: Automotive Technology, Industrial Technology, Consumer Goods, and Energy and Building Technology.

The Bosch Group comprises Robert Bosch GmbH and its roughly 360 subsidiaries and regional companies in some 50 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth.

Bosch Global Software Technologies Company Limited (BGSV) is 100% owned subsidiary of Robert Bosch GmbH - one of the world’s leading global suppliers of technology and services, offering end-to-end Engineering, IT, and Business Solutions.

Starting its operation from 2010 at Etown 2 in HCMC, BGSV is the first software development center of Bosch in Southeast Asia. BGSV nowadays have over 4,000 associates, with a global footprint and presence in the US, Europe, and the Asia Pacific region.

With our unique ability to offer end-to-end solutions that connect sensors, software, and services, we enable businesses to move from the traditional to digital or improve businesses by introducing a digital element in their products and processes.

Job Description

We are seeking a hands-on Senior Hardware Engineer to design, bring up, and validate high-performance electronic hardware platforms for automotive applications, including ADAS and infotainment systems. You will own assigned board-level designs from requirements and component selection through schematic development, PCB layout support, laboratory debugging, and design release.

This is an individual contributor role focused on circuit design, engineering analysis, and practical problem-solving. You will work closely with PCB layout, software, system, mechanical, and manufacturing teams to resolve hardware issues and deliver robust designs that meet performance, power, reliability, and manufacturability requirements.

For additional project information, please refer to: https://www.bosch-semiconductors.com/stories-and-events/chiplet-revolution/

Key Responsibilities:

• Translate system requirements into board-level specifications, circuit designs, and verification criteria for assigned hardware.
• Perform component selection, schematic capture, circuit calculations, and design trade-off analyses for high-performance SoC-based platforms.
• Design and verify power supplies, power sequencing, clocking, reset circuits, and peripheral interfaces.
• Work with PCB layout engineers to define multilayer stack-ups, placement, routing constraints, and impedance requirements; review layouts before fabrication.
• Implement high-speed interfaces such as PCIe Gen 3/4/5, LPDDR5, USB 3.x, SGMII/RGMII, and 10G Automotive Ethernet in accordance with platform requirements and device guidelines.
• Develop and execute board bring-up and validation plans, including power-rail checks, boot verification, interface testing, and operating-margin characterization.
• Debug board- and system-level failures using laboratory measurements, schematic analysis, and structured experiments to isolate root causes.
• Perform power-budget and thermal analyses, assess component operating margins, and support reliability evaluations.
• Perform or support Signal Integrity (SI) and Power Integrity (PI) simulations, correlate results with measurements, and resolve signal-quality and power-delivery issues.
• Implement corrective design changes, verify their effectiveness, and document root causes, test evidence, and engineering change decisions.
• Collaborate with software and system engineers to resolve hardware-software integration issues during bring-up and validation.
• Work with component suppliers, development partners, and manufacturing teams to resolve component, prototype, and production-related technical issues.
• Apply design for manufacturability (DFM), design for testability (DFT), EMI/EMC, reliability, and applicable automotive requirements; maintain complete design and validation documentation.

Qualifications

• Bachelor’s or master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
• At least 5 years of hands-on experience in board-level electronic hardware design, development, and debugging. Prior people-management experience is not required.
• Demonstrated experience designing and bringing up SoC- or processor-based boards, with hands-on knowledge of power supplies, clocking, reset, memory, and high-speed interfaces. Experience with one or more interfaces such as PCIe, LPDDR, USB, or Ethernet is required.
• Experience in automotive electronics development is highly desirable.
• Strong understanding of transmission-line theory, impedance control, PCB stack-up design, high-speed interface design, and EMI/EMC mitigation techniques.
• Proficiency in industry-standard electronic design automation tools, such as Cadence Allegro/OrCAD, Altium Designer, or Siemens EDA tools.
• Working knowledge of SI/PI analysis and the ability to interpret simulation results; hands-on experience with Ansys HFSS or SIwave, Cadence Sigrity, or Keysight ADS is an advantage.
• Strong hands-on laboratory skills using oscilloscopes, multimeters, and programmable power supplies to debug circuits and validate hardware. Experience with bit-error-rate testers, vector network analyzers, or time-domain reflectometers is an advantage.
• Practical experience with schematic and PCB layout reviews, board bring-up, validation, and design release, including demonstrated ability to isolate hardware faults and verify corrective actions.
• Knowledge of design for manufacturability and design for testability principles.

Soft skills

• Communication: Clear written and verbal English communication skills, with the ability to explain design decisions, debug findings, and technical risks.
• Problem-solving: Structured, data-driven approach to forming hypotheses, planning experiments, analyzing measurements, and identifying root causes.
• Ownership: Ability to work independently on assigned designs, follow issues through to verified resolution, and raise risks early.
• Engineering discipline: Attention to detail in design reviews, laboratory measurements, documentation, and verification of design changes.
• Collaboration: Ability to work effectively with global teams, suppliers, development partners, and manufacturing organizations.

Further details regarding compensation and benefits will be shared during the interview process.