Product Engineer

Join our team as a Product Engineer and play a key role in bringing high-performance mixed-signal audio products from development to high-volume manufacturing. In this hands-on engineering role, you’ll work at the intersection of product, test, and manufacturing, driving new product introductions (NPI), optimizing production performance, and solving complex technical challenges. You'll have the opportunity to make a direct impact on product quality, yield, cost, and customer success while collaborating with talented cross-functional teams across the organization.

Responsibilities:

• Serve as the engineering interface between Cirrus Logic and test sites for engineering support.
• Drive resolution of engineering and production issues, including process, hardware, and test challenges.
• Verify, debug, and release engineering and production test programs.
• Collaborate with cross-functional teams on data collection, experiments, and disposition of engineering issues.
• Monitor production yield and test time across multiple products.
• Manage production lines by resolving technical and quality issues.
• Perform periodic audits of test sites in accordance with Cirrus Logic procedures.

Required Skills and Qualifications:

• BS in Electrical Engineering (or equivalent field) with proven Product Test Engineering experience.
• Experience with mixed-signal tester platforms, preferably Teradyne.
• Knowledge of test hardware debugging, schematic analysis, and PCB troubleshooting.
• Experience maintaining, troubleshooting, repairing, and calibrating wafer probing equipment (e.g., TSK/Accretech, OPUS SEMIC).
• Strong analytical, diagnostic, and problem-solving skills.
• Experience with SQL, Unix, and C programming.
• Proficiency with Spotfire and/or JMP for data analysis and visualization.
• Experience supporting high-volume manufacturing.
• Ability to work with cross-functional teams across multiple locations.
• Self-motivated and able to work in a fast-paced environment.
• Ability to effectively communicate in English.

Preferred Skills and Qualifications:

• Experience with WLCSP probing or related bumping technology.
• Experience with probe head design, PCB hardware repair, soldering, and failure analysis.
• Experience with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Experience with PCB schematic/layout tools and Teradyne test platforms.