Physical Design Engineer

Key Responsibilities

Physical Design Implementation

• Own complete Physical Design flow from synthesis handoff to GDSII.
• Perform Floor planning, Power Planning, Placement, CTS, Routing, Physical Optimization, and ECO implementation.
• Drive block-level and full-chip design closure on advanced FinFET nodes.
• Execute congestion analysis and optimization to achieve PPA targets.

Timing Closure

• Perform timing analysis using Synopsys PrimeTime.
• Resolve setup, hold, transition, capacitance, and noise violations.
• Drive MCMM timing closure across multiple corners and modes.
• Implement timing ECOs and optimize critical timing paths.

Physical Verification & Signoff

• Run and debug DRC/LVS/ERC violations using industry-standard signoff tools.
• Analyze and resolve physical design issues impacting manufacturability.
• Ensure successful tapeout readiness.

Power & Signal Integrity

• Perform IR Drop and EM analysis.
• Optimize power distribution networks.
• Perform signal integrity checks and noise analysis to ensure robust silicon performance.

Design Optimization

• Drive area, power, and performance optimization.
• Work closely with RTL, DFT, STA, and P&R teams to achieve design convergence.
• Support Design-for-Manufacturability (DFM) requirements.

Required Technical Skills

Synopsys Tool Expertise

• Strong expertise in:
  • Synopsys ICC2
  • Fusion Compiler
  • PrimeTime
  • StarRC
  • IC Validator
  • Design Compiler (Good to Have)

Physical Design Skills

• Floorplanning
• Power Planning
• Placement Optimization
• Clock Tree Synthesis (CTS)
• Routing & Optimization
• Timing Closure
• ECO Closure
• Signoff Closure
• Low Power Implementation

FinFET Experience

• Mandatory hands-on experience in:
  • 16nm FinFET
  • 12nm FinFET
  • 7nm FinFET
  • 5nm FinFET (Preferred)

Signoff Expertise

• MCMM Timing Closure
• Signal Integrity Analysis
• Crosstalk Analysis
• IR Drop Analysis
• EM Analysis
• DRC/LVS Closure