R&D Test Engineer, Thermal/Mechanical/Reliability

We are seeking an on-site R&D Test Engineer to join our AI Chips team. This role will work closely with the thermal/mechanical/reliability lead to execute thermal testing, coordinate reliability testing, design and develop custom test hardware and fixtures for customer prototyping of single-crystal diamond applications on AI customer chips, and generate engineering insights that guide customer engagements and product development.

The ideal candidate is a hands-on thermal or mechanical engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.

This position will be located out of our San Jose office.

Responsibilities

• Support customer prototyping projects through design and development of mechanical fixtures and experimental apparatus using CAD software, and coordinate fabrication with internal and external machine shops.

• Coordinate accelerated lifetime reliability testing and environmental stress testing per industry standards to validate long-term performance and durability of SCD-on-silicon attachment methods, package integrity.

• Design, build, operate, and troubleshoot thermal characterization test platforms to evaluate SCD thermal solutions on thermal test vehicles (TTVs) and customer hardware.

• Develop assembly processes for prototype hardware, including thermal interfaces, mounted cooling solutions, and instrumentation integration as needed.

• Manage project schedules, technical risks, cross-functional communication, customer updates, and technical reports.

Requirements

• Degree & Experience: BS or MS in Mechanical Engineering or a related discipline, with 2+ years of experience in mechanical/thermal engineering, test engineering, or product development.

• Thermal & Reliability Testing: Experience with laboratory instrumentation and data acquisition systems (Preferred: thermal testing/characterization for packaged devices, liquid cooling solutions like fans/cold plates, and reliability/environmental stress testing).

• Software & Simulation: Proficiency with CAD software (SolidWorks preferred) (Preferred: familiarity with FEA and CFD tools such as ANSYS Mechanical/Fluent, Icepak, or COMSOL).

• Data Analysis & Fabrication: Experience creating engineering drawings to support fabrication, alongside data processing and analysis using MATLAB, Python, Excel, JMP, or similar tools (Preferred: familiarity with IC packaging, metrology, or failure analysis).

• Professional Attributes: Strong problem-solving and communication skills, with a hands-on, detail-oriented mindset, comfortable working cross-functionally in a fast-paced R&D environment.