Location
In office (Suzhou)
Confirmed on the employer's own hiring board on Oct 29, 2026. First seen by Alion on Mar 19, 2026. Fibocom scores B on the Alion truth index.
Overview
Company
Impact
Profile match
Fibocom designs wireless communication modules for the internet of things. Its cellular, positioning and short-range modules connect vehicles, meters and industrial equipment. The company supplies module customers across many global markets.
岗位职责 / Responsibilities
1. 负责Android系统在硬件平台上的BSP移植、定制与适配
2. 开发与维护外设驱动(如LCD、TP、Camera、Wi-Fi/BT、Audio、SDIO等),确保硬件与Android HAL层的兼容性
3. 分析和解决系统底层问题(如启动失败、卡顿、功耗异常、驱动故障),使用GDB、Perf、Systrace等工具进行性能优化。
4. 针对系统启动时间、内存管理、功耗、热管理等进行专项优化,提升系统稳定性和用户体验
5. 与硬件团队协作制定软硬件接口协议,参与关键外设模块的选型,提供软件层面建议。支持应用层团队解决底层兼容性问题
6. Android系统版本的发布与维护
7. 撰写相关设计文档
任职要求 / Requirements
1. 计算机、电子工程、通信等相关专业本科及以上学历
2. 3年以上Linux/Android BSP开发经验,熟悉嵌入式系统开发流程
3. 熟练掌握C/C++编程,熟悉Linux内核机制(内存管理、进程调度、中断处理)及驱动开发框架
4. 掌握常见硬件接口协议(如I2C、SPI、UART、USB),能阅读原理图和数据手册。
5. 熟悉Android系统架构(HAL、Framework)、ARM架构(Cortex-A系列)及交叉编译环境。
6. 具备较强的问题定位能力、逻辑思维和团队协作精神,能适应跨部门沟通。
7. 具备良好的英语阅读能力,可熟练查阅芯片技术文档及AOSP资料。
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