SI/PI Engineer
Confirmed on the employer's own hiring board on Oct 16, 2026. First seen by Alion on Oct 12, 2026. Getvinci scores B on the Alion truth index.
About Us
We are building Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows.
Our first product bridges the gap between the accuracy & determinism of traditional simulation and the speed & scaling of AI, and is redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems.
Role Overview
As part of the Forward Deployment Sales team, you will play a key role in accelerating the adoption of Vinci’s software with leading engineering teams. You will work closely with prospective customers to demonstrate Vinci’s capabilities and show how the platform can significantly improve product design, thermal performance, time to market and reliability.
In this role, you will apply your power architecture, electromagnetics and transmission line theory to build and simulate models from real customer designs, validating Vinci's software and proving its value in production workflows. The work spans SI/PI analysis of high speed interfaces (HBMm DDR/LPDDR, PCIe, SerDes, UCIe) and power delivery networks across the full chip-package-PCB stack and puts you in front of customers regularly for training and technical deep-dives.
You will work directly with customer engineering teams to understand their requirements, field technical questions, and articulate what Vinci's software can do. What you learn in those engagements feeds back into the roadmap, surfacing the needs and gaps that shape where the product goes next.
This is a hybrid role, with the expectation of working 3 days per week in our Palo Alto office for close collaboration with Sales, Product, and Engineering. The role includes moderate travel, primarily within the United States. Some infrequent international travel may be required for key customers and events in Asia and Europe.
Responsibilities
Engage with customer package and PCB design engineers during evaluations: set up simulations, run test cases, and turn SI/PI results into layout optimization recommendations.
Assess system-level SI/PI performance and correlate Vinci results against industry-standard EM and circuit simulation tools.
Work with the sales team on product demos, proof-of-concept evaluations, and technical deep-dives with prospective customers.
Support onboarding and deployment with technical guidance, training, and troubleshooting through production use.
Identify customer pain points in SI/PI workflows and work with product and engineering teams to improve capabilities.
Deliver training sessions and workshops so customer teams can adopt and scale Vinci in their design flows.
Represent Vinci at industry conferences and semiconductor events through live demos and technical engagement with prospects and partners.
Track industry trends, emerging technologies, and best practices in SI/PI design methodologies and competing tools, so you can clearly explain what sets Vinci apart.
Qualifications (Minimum Qualifications)
Degree in Electrical Engineering or a related field, with a strong academic background in EM theory and transmission lines
5-10+ years of hands-on SI/PI analysis for high-speed interconnects in chip/package or system PCB design
Experience with industry SI/PI modeling toolchains: Ansys HFSS/SIwave/Q2D, Keysight ADS, Cadence Sigrity, SPICE/Spectre, or similar
Working knowledge of SI fundamentals for high-speed SerDes and parallel interfaces, plus PI fundamentals: PDN impedance, decoupling, IR drop, and noise
Scripting skills in Python, MATLAB, or Perl
Experience in a customer-facing engineering role
Strong problem-solving instincts and a record of learning new tools and workflows quickly
Ability to explain complex technical results clearly to both engineering and business audiences
Preferred (Desirable Differentiators)
Experience with 2.5D/3D heterogeneous packaging and HBM/DRAM SI/PI for AI accelerator or HPC silicon
Experience driving SI/PI requirements from architecture definition through post-silicon validation
Background in pre-sales or technical sales for EDA or simulation software
Comfort with AI-assisted design tools and emerging physics-based workflows
Why Join Us
Not just use AI, Be part of a team that is actively redefining how the next-generation silicon and hardware are architected.
Work at the absolute convergence of state of the art AI models, fundamental physics, and high-stakes enterprise
Collaborate with world-class engineers and researchers in a fast-moving startup environment.