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Salary
$118k – $239k per year
Location
In office (United States, Santa Clara)
Seniority
Staff · 10+ years exp
Visa
H-1B filings in 12 months: 100 · for this role: 16 · green card filings: 45
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on May 12, 2026. GlobalFoundries scores B on the Alion truth index.

Overview
Company
Impact
Profile match
GlobalFoundries is a semiconductor foundry headquartered in Malta, New York, near Albany, that manufactures chips for other companies on FD-SOI, FinFET, RF, silicon germanium, silicon photonics, power and GaN process technologies, and also offers MIPS processor designs. Founded in 2009 and listed on Nasdaq, it runs fabs in New York, Vermont, Dresden and Singapore with engineering and design centres in Austin, Santa Clara, Bengaluru and Penang. It hires process, equipment, yield and tapeout engineers, maintenance technicians and apprentices, field application engineers and interns in engineering and finance.

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundriesmakespossible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com.

Summary of Role: GlobalFoundries isseekingan experiencedthermal,mechanical, and/or electrical modeler/engineer withdemonstratedcryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance.

Essential Responsibilities:

  • Demonstrated experience using commercial software to develop and correlate cryogenicthermal,mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.

  • Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.

  • Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.

  • Facilitate discussion withoriginatingteam toidentifysimulations that highlight critical process interactions and driveoptimal3DHI technology decisions.

  • Apply commercial simulation software to mimiccryogenicsemiconductor process flows and highlight the areas of concern.

  • Extensive interaction with integration, device, and design engineers toassuredevelopment ofa workingtechnology.

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.

  • Other duties as assigned bymanager.

Required Qualifications:

  • M.S. + minimum of10years of relevant experience.

  • Semiconductor mechanical,thermaland/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications.

  • Strong problem solving and technical trouble shooting skills including expertisein design of experiment.

  • Must have at least an overall 3.0 GPA and proven good academic standing.

  • Language Fluency - English (Written & Verbal).

  • Solid understanding of semiconductor processes and integration techniques.

  • Good computer / software skills.

  • Ability to clearly present results to small and large groups.

  • Travel - Up to 10%.

Preferred Qualifications:

  • PhD +8years of relevant experience.

  • Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…).

  • Demonstrated work performance in an environment requiringa highlevelof attention to detail and timeliness.

  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.

  • Project management skills,i.e.the ability to innovate andexecutesolutions that matter; the ability to navigate ambiguity.

  • Strong written and verbal communication skills.

  • Strong planning& organizationalskills.

Expected Salary Range

$118,000.00 - $239,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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