Physical Design Lead, TPU, ASIC

About the job

In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.

Google’s Tensor Processing Units (TPUs) are incredibly complex, pushing the boundaries of physical design, power, and performance. In this role, you will work and provide technical leadership for the physical design of critical sub-chips on our next-generation AI silicon.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.

US: $192000 - $278000 (USD) + 20% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities

• Lead the physical design implementation and strategy for high-performance silicon for critical, high-complexity subchips.
• Manage the full design cycle from RTL to GDSII, including critical sign-off closures for timing, electrical performance, and power integrity.
• Partner with internal teams (RTL, DFT, methodology, packaging) to achieve optimal power, performance, and area (PPA) results, including conducting feasibility studies for new microarchitectures and optimizing RTL runs.
• Collaborate with external EDA and IP vendors to improve flows and methodologies, while contributing to internal processes to ensure efficient and predictable execution.
• Drive execution schedules, resource planning, and risk mitigation for your area of ownership, scaling your leadership to support overall project-wide milestones.

Qualifications

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
• 10 years of experience in physical design, including leading full-chip or sub-chip implementation such as RTL2GDSII and overseeing key stages like floorplanning, place and route, and timing closure for high-speed ASICs across various process nodes.
• Experience in Python, Tcl, or Perl scripting.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
• Experience with Cadence Innovus, Synopsys DP, Mentor Calibre, and StarRC, and understanding of foundry technology files, rule decks, physical sign-off, and 2.5D/3D packaging.
• Technical leadership experience managing execution schedules, mitigating risks, and driving cross-functional collaboration with internal teams and external vendors.
• Understanding of performance, power, and area trade-offs, alongside knowledge of DFT including Scan, MBIST, and LBIST.
• Ability to navigate ambiguity, scale leadership across the physical design hierarchy, and excellent communication skills to articulate complex technical challenges to stakeholders.