Process Integration Engineer, Quantum AI

About the job

Google Quantum AI is building quantum computing for otherwise unsolvable problems. The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

In this role, you will be developing and integrating new semiconductor wafer processes. Responsibilities will include developing novel fabrication techniques, enabling new designs through fab, and transferring processes to production. You will create proper documentation, effectively summarize and communicate results, and train others on the proper use of process equipment. You will be comfortable working independently and collaborating effectively with fellow teammates.

US: $132000 - $189000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities

• Fabricate Google’s next generation quantum devices.
• Develop, integrate, and sustain semiconductor microfabrication processes by utilizing and maintaining the correspondent equipment.
• Provide on demand fabrication process troubleshooting and stability.
• Create clear documentation for new processes as they are released to production.
• Build infrastructure to enable increase in experimental speed and volume.

Qualifications

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
• 2 years of experience developing and sustaining semiconductor fabrication processes in a cleanroom environment.
• 2 years of experience in one or more conventional wafer fabrication areas such as lithography, deposition, etch, photoresist strip, singulation, or metrology.
• 1 year of experience working in a cleanroom environment.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
• Experience with 3D process integration, and multi-wafer process integration.
• Experience with etching, thin film, materials characterization, CAD tools, wafer level probing, failure analysis, and packaging.
• Experience with quantum device fabrication.