layout 工程师(J19066)

H3C Technologies · Chinese: C1 · Cybersecurity · Hardware · 10 days ago

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Salary

≈ $16k – $43k per year (Estimated)

Location

In office (Wuhan)

Confirmed on the employer's own hiring board on Nov 2, 2026. First seen by Alion on Oct 23, 2026. H3C Technologies scores C on the Alion truth index.

Overview

Company

Impact

Profile match

H3C Technologies

H3C (H3C Technologies) is a leading global provider of digital and AI infrastructure solutions, specializing in enterprise networking, cloud computing, storage, cybersecurity, and high-performance server systems. Headquartered in Beijing and Hangzhou, China, the company delivers comprehensive, full-stack IT solutions and technical services to major enterprise and public-sector clients across telecommunications, government, finance, healthcare, and education. Empowering organizations to modernize their core technology environments, the firm provides scalable, secure, and intelligent foundations tailored for complex data-intensive and artificial intelligence workloads worldwide.

h3c.com · HQ: Hangzhou, Beijing, China · Telecommunications · Hardware · Cybersecurity · Network Security · Enterprise Storage Systems · Servers & Data Center Hardware · Network Equipment · 1001-5000 employees · Est. 2003

Tech stack of H3C Technologies

岗位职责 / Responsibilities

1. 负责800G/1.6T/NPO/CPO等高速光模块PCB全流程设计，包括叠层规划、阻抗架构设计、布局布线、DFM评审及工艺对接

2. 协同硬件工程师、信号完整性工程师及光学团队，完成设计约束制定、叠层规划和布局优化;

3. 深入分析并解决高速信号完整性（SI）、电源完整性（PI）及电磁兼容性（EMC）相关问题

4. 输出PCB源文件、Gerber、钻孔文件、拼板文件、工艺说明及版本履历，保证文档规范、完整、可追溯。

5. 文件标准化：编制、修订光模块PCB相关工艺文件、作业指导书、质量控制计划（QCP）、FMEA、规格书等

任职要求 / Requirements

1，本科及以上学历，3年及以上高速光模块光模块PCB产品相关工作经验

2，熟练使用Cadence、AD等主流PCB设计软件，精通PCB封装绘制、多层板Layout流程。

3，备扎实的信号完整性基础知识，熟悉阻抗控制、损耗分析、串扰抑制等设计方法

4，熟悉高速PCB基础设计规范，了解阻抗匹配、差分等长、串扰控制、电源布线基本原则

5，熟悉PCB制造工艺及材料特性（如高速板材M6/M7、HDI等）

6，熟悉PCB生产工艺、SMT贴片工艺、DFM设计要求，能够独立处理量产Layout问题

7，具备良好的团队协作能力和严谨的工作态度，能承担项目压力并保证设计质量

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