Electrical Signal Processing ASIC Design for Imaging Spectrometers

The Challenge Imaging spectrometers capture both
spatial and spectral information for applications such as material
identification, environmental monitoring, and industrial sensing. Their
performance depends not only on optical filters and photodetectors but also on
the electrical readout and signal processing circuits. Designing compact
imaging spectrometers requires efficient readout integrated circuits (ROICs)
and controller architectures that provide accurate signal acquisition while
maintaining low noise, high dynamic range, and low power consumption. This project explores electrical
signal processing ASIC architectures for imaging spectrometers, focusing on the
integration of photodetector readout, signal conditioning, and mixed-signal
circuit design. System-level modeling and circuit simulations will be used to
evaluate the interactions between optical response, detector characteristics,
and electrical readout performance.   What You Will Do You will get the chance to:
Investigate
ROIC and controller ASIC architectures , including detector biasing,
signal integration, amplification, sampling, and analog-to-digital
conversion.
Develop
behavioral and circuit-level models to evaluate electrical signal
processing requirements and system performance.
Design
and simulate analog and mixed-signal circuits for photodetector interfaces
using appropriate EDA tools.
Evaluate
optical–electrical system trade-offs , including noise, dynamic
range, spectral accuracy, acquisition speed, and power consumption.
Support
circuit verification and prototype evaluation , potentially including
layout-related activities and experimental characterization. Your design work will be supported
by system-level analysis and circuit simulations to understand how electrical
design choices influence imaging spectrometer performance. You will also have
the opportunity to collaborate with experienced researchers and engineers in an
international multidisciplinary research environment.   Requirements The project offers experience in
analog and mixed-signal ASIC design, sensor interface circuits, and electrical
signal processing for imaging spectrometers. A background in electrical
engineering, electronic circuits, semiconductor devices, or integrated circuit
design is desirable. Experience with circuit simulation tools,
Verilog/SystemVerilog, Python, or MATLAB is an advantage. The balance between
architecture development, circuit design, and system-level analysis can be
adjusted to the candidate's background and interests. A strong command of
English is essential for effective communication. Time Distribution 40% ASIC architecture and circuit
design, 30% modeling and simulation, 20% verification and characterization, 10%
literature study and reporting Type of internship : Master internship Duration : 12months Required educational background : Electrotechnics/Electrical Engineering University promotor : Jan Genoe (KU Leuven) Supervising scientist(s) : For further information or for application, please contact Jaewon Nam ( [email protected] ) and Gokhan Kara ( [email protected] ) The reference code for this position is 2026-INT-325 . Mention this reference code in your application. Only for self-supporting students. Applications should include the following information: resume motivation current study Incomplete applications will not be considered