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Location
Hybrid (Bengaluru, India)
Seniority
Principal · 8+ years exp

Confirmed on the employer's own hiring board on Oct 14, 2026. First seen by Alion on Aug 11, 2026. Infineon Technologies scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Infineon Technologies is a semiconductor company near Munich that was spun out of Siemens in 1999. It is the world leader in power semiconductors and a major supplier of automotive chips, security controllers and sensors. The company operates fabrication plants in Germany, Austria and Malaysia and is building a large new site in Dresden.

Weareseekingahighlymotivated Principal Engineer Design to lead the physical implementation and timing closure of advanced low-power SoCstargetingtheIoTandMCUmarkets.Thisroleofferstheopportunitytodriveend-to-endphysicaldesignexecution,optimizepower,performance,andarea(PPA),andinfluencemethodologyimprovementsthatenablesuccessfulsilicondelivery.

Theidealcandidatewillpossessdeepexpertiseinphysicaldesign,timingconvergence,low-powerimplementationmethodologies,andsignoffprocesseswhiledemonstratingstrongtechnicalleadershipandcross-functionalcollaborationskills.

Your role

Key responsibilities in your new role

  • Leadphysicaldesignandtimingclosureforcomplexlow-powerSoCstargetingIoTandMCUapplications.
  • Manageend-to-endphysicalimplementationfrom floor planning tofinalsignoffwhilemeetingPower,Performance,andArea(PPA)objectives.
  • Driveandoptimizediearea,timing,power,andperformanceforbothhierarchicalblock-levelandfull-chipdesigns.
  • Owncriticalphysicaldesignactivities,includingpackageco-design,floor planning,powerplanning,powergriddesign,place-and-route(P&R),clocktreesynthesis(CTS), timingclosure,andphysicalsignoff.
  • Ensuresuccessfultimingconvergenceacrossmultipleoperatingmodesandprocess,voltage,andtemperature(PVT)corners.
  • Performandoverseephysicalverification,signoffvalidation,anddesignreadinessreviews.
  • CollaboratecloselywithArchitecture,RTLDesign,DFT,Verification,Packaging,ProductEngineering,Foundry,andothercross-functionalteamstoresolveimplementationchallenges.
  • DriveimprovementsinEDAtools, designmethodologies,automation,andimplementationflowstoenhanceQualityofResults (QoR), productivity,anddesignefficiency.
  • Providetechnicalleadershipindefiningphysicalimplementationstrategies,riskmitigationplans,andsignoffmethodologies.
  • Mentorandguideengineers,promotetechnicalexcellence,anddriveadoptionofindustrybestpracticesacrosstheorganization.

Your profile

Qualifications and skills to help you succeed

  • Bachelor'sorMaster'sdegreeinElectronics,ElectricalEngineering,VLSI,ComputerEngineering,orarelateddiscipline.
  • 8+yearsofhands-onexperienceinPhysicalDesignandTimingClosureforcomplexSoCproducts.
  • Provensuccessindrivingchipimplementationfromfloor planningthroughtape outandsilicondelivery.
  • Strongunderstandingofadvancedsemiconductorprocesstechnologiesandassociatedphysicaldesignchallenges.
  • Experiencedeliveringlow-powerSoCsforIoT,MCU,consumer,mobile,automotive,orrelatedapplications.

TechnicalSkills&Expertise

  • DeepexpertiseinhierarchicalSoCphysicaldesign,implementation,andtimingconvergence.
  • Strongproficiencywithindustry-standardPhysicalDesign,Signoff,andEDAautomationtools.
  • Hands-onexperiencein:
    • Floor planningandphysicalpartitioning
    • Powerplanningandpowergriddesign
    • PlaceandRoute(P&R)
    • ClockTreeSynthesis(CTS)
    • StaticTimingAnalysis(STA)
    • Multi-mode,multi-corner(MMMC)timingclosure
    • Physicalverificationandsignoff
    • EM/IRandpowerintegrityanalysis
  • In-depthknowledgeoflow-powerdesignmethodologiesandimplementationtechniques.
  • Strongunderstandingofprocesstechnologytrade-offsaffectingPower,Performance,andArea(PPA).
  • Abilitytoanalyzeandsolvecompleximplementationchallengesthroughdata-drivendecision-makingandtechnicalcollaboration.

Leadership&Collaboration

  • Drivetechnicaldecisionsandtakeownershipofimplementationquality,schedule,anddeliverables.
  • Collaborateeffectivelywithcross-functionalteamsacrossArchitecture,RTL,Verification,DFT,Packaging,andFoundryorganizations.
  • Leadtechnicaldiscussions,designreviews,andimplementationstrategyplanning.
  • Mentoranddevelopjuniorengineerswhilefosteringacultureoftechnicalexcellence.
  • Promoteknowledgesharing,bestpractices,andcontinuouslearningacrossteams.
  • Championinnovationinmethodologies,designflows,automation,andtoolusage.
  • Demonstratestrongcommunication,stakeholdermanagement,andproblem-solvingcapabilities.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Anand Rawal

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