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Location
In office (Malacca)
Seniority
Principal · 12+ years exp

Confirmed on the employer's own hiring board on Sep 28, 2026. First seen by Alion on Aug 11, 2026. Infineon Technologies scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Infineon Technologies is a semiconductor company near Munich that was spun out of Siemens in 1999. It is the world leader in power semiconductors and a major supplier of automotive chips, security controllers and sensors. The company operates fabrication plants in Germany, Austria and Malaysia and is building a large new site in Dresden.

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Unit Process Development, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role

Key responsibilities in your new role

In this role, you will drive the development, optimization, and industrialization of wire bond and assembly processes, ensuring high-quality, cost-competitive, and manufacturable solutions while supporting new product and package introductions. You willprovide technical leadership in process innovation, problem-solving, technology development, supplier collaboration, knowledge transfer, and cross-functional project execution, serving as a subject matter expert and consultant across sites and global engineering communities.

  • Identify and develop new processes for product/package, and putting in place process controls to make sure the products/packages are of a high quality and are manufactured in a reproducible manner
  • Perform Wire Bond Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturability
  • Responsible for technical handshake and knowledge transfer to Operation
  • Support prototype and development samples build
  • Generate and update relevant documents, (e.g. Process Specification, PFMEA, DFMEA, OJTI, T32, PDR)
  • Provide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, etc.) for development projects
  • Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects
  • Technical lead for task force and complex problem-solving team using Statistical and analytical tools, (e.g. SPC, APC, DOE, 8D, FMEA, DFMEA, etc.)
  • Identify and develop new Process technology and improve Process capability to meet new requirements from Business divisions
  • Support the definition of Process technology, material, machine and tooling
  • Providetechnical guidance/buddy to other engineers and project team
  • Initiating, generating and drive IP ideas based on reading and research
  • Keep abreast with emerging technology to lead the definition and direction of Process technology, material, machine and tooling
  • Be consultant of the FOK within sites and IFX globally
  • Be the multiplier of the FOK in TL community
  • Lead technical critical path for the DEV related projects and FOK attention within sites

Your profile

Qualifications and skills to help you succeed

You strive toleverage deep expertise in wire bond and semiconductor assembly processes, utilizing strong analytical, problem-solving, and data-driven methodologies to develop robust, reliable, and manufacturable solutions. You demonstrate hands-on technical capability in process development, material science, and statistical analysis, enabling continuous process innovation, optimization, and operational excellence.

  • Masters/Bachelor's Degree inEngineering or relevant course with a minimum 12 years working experience in semiconductor manufacturing industry, preferably in Wire Bond process
  • Stronghands-on knowledge andskills inassembly area
  • Stronganalytical and problem-solving skills
  • Knowledge of material science and chemical engineering know how
  • Good in analytical equipment knowledge
  • Experience instatistical data analysis including design of experiment

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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