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Salary
≈ $36k – $84k per year (Estimated)
Location
In office (Shanghai)
Seniority
Senior · 8+ years exp

Confirmed on the employer's own hiring board on Oct 27, 2026. First seen by Alion on Sep 8, 2026. Biren Technology scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Biren Technology is a Shanghai semiconductor company founded in 2019 that designs general-purpose graphics processors for artificial intelligence training and inference. Its data centre accelerators are among the main domestic alternatives available to Chinese cloud operators under export restrictions. The company develops its own software stack so the chips can run mainstream deep learning frameworks.

岗位职责:

1. 完成SoC芯片内部功能模块的MAS文档和设计交付;

2. 完成子系统级/芯片级系统集成工作;

3. 协助完成模块/系统的FPGA/EMU原型验证;

4. 协助SoC DV团队完成模块验证和SoC级别验证;

5. 完成Lint/CDC等规则检查和SDC的撰写;

6. 完成IP技术评估,IP集成和IP应用支持的工作;

7. 完成自动化流程脚本开发、更新和维护的工作;

8. 配合验证团队完成SoC/IP验证计划的定义,验证测试的开发;

9. 配合中后端紧密合作完成模块的时序收敛和流片签核等工作;

10. 完成芯片系统联调的工作,根据需要输出各种方案,报告等文档。

任职要求:

1. 熟悉计算机体系结构,有过模块设计经验;

2. 熟悉SoC架构和顶层接口,有高性能或先进工艺SoC设计经验优先;

3. 熟悉AMBA总线(ACE.AXI.AHB.APB);

4. 熟悉芯片级时钟复位模块,GPIO/I2C/SPI/UART接口模块,SMU等方面的设计;

5. 熟悉SoC设计前端开发流程

6. 扎实的RTL 代码开发能力;

7. security 设计经验优先;

8. 大规模AI/GPU芯片设计经验优先;

9. 微电子,计算机等相关专业本科以上学历,8年以上SoC设计经验。

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