硬件工程师(J11269)

BIWIN · Chinese: C1 · Digital Storage · Computer Components · 27 days ago
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Salary
≈ $29k – $66k per year (Estimated)
Location
In office (Shenzhen)
Seniority
Middle · 3+ years exp

Confirmed on the employer's own hiring board on Oct 30, 2026. First seen by Alion on Feb 24, 2026. BIWIN scores C on the Alion truth index.

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Profile match

BIWIN

BIWIN, formally Shenzhen BIWIN Storage Technology, is a Chinese semiconductor memory company headquartered in Shenzhen that designs, packages and tests storage products, including embedded eMMC, UFS and LPDDR memory, solid state drives, DRAM modules and memory cards. Founded in 2010 and listed on the Shanghai STAR Market under code 688525, it is recognised as a national high-tech enterprise and has received strategic investment from the second phase of China's National Integrated Circuit Industry Investment Fund. Its openings include 2027 graduate roles in accounting, HR, SMT and AOI process and MES engineering, plus senior chip architecture and packaging process positions.
biwin.com.cn · HQ: Shenzhen, China · Memory & Storage Chips · Computer Components · Digital Storage · 1001-5000 employees · Est. 2010
Tech stack of BIWIN
Backed by Fortune Capital

岗位职责 / Responsibilities

工作职责：

1.存储相关硬件设计，研发装备硬件设计，嵌入式芯片量产装备设计;

2.BOM维护，硬件调试，CIS库维护，硬件文档撰写和维护;

3.参与硬件技术预研;

4.生产/市场技术支持工作;

任职要求 / Requirements

任职资格：

1、电子工程、电子信息、微电子、通信、自动化等相关专业本科及以上学历;

2、3年以上硬件设计经验，有过8层以上板卡的设计经验;

3、具备扎实的硬件技术功底，良好的学习能力、创新能力和分析能力;

4、熟悉高速信号接口、DC-DC/LDO，数字、模拟电路原理和设计;

5、熟悉PI/SI/EMC理论和工程应用;

6、有SSD、DDR模组、FPGA、嵌入式CPU等产品开发经验优先;

7、良好的沟通表达能力及团队合作意识，责任心强。

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