Semiconductor Engineer (High-Speed Interfaces / Hardware Solutions)

We are seeking an experienced Semiconductor Engineerwith deep expertise in high-speed hardware design, signal/power integrity, andsystem-level architecture. The role bridges hands-on engineering with technicalsolution architecture and customer-facing activities, supporting semiconductor,memory, test & measurement, and embedded computing customers globally.

You will own architecture definition throughbring-up and validation of high-speed boards and systems (PCIe Gen5/6, NVMe,SerDes, FPGA/SoC platforms), contribute to design wins, and support technicalpre-sales and proposal activities.

Key Responsibilities

• Architect and deliver high-speed hardware solutions including PCIe Gen5/Gen6 CEM add-in cards, slot interposers with embedded FPGA, NVMe/SSD protocol-test platforms, and multi-variant Open VPX / VNX+ Single Board Computers (SBCs).
• Perform end-to-end product/system design: architecture definition, component selection, schematic capture, low-loss stackup (e.g., Megtron 6), layout guidelines, SI/PI/thermal analysis, board bring-up, characterization, and system integration.
• Execute signal and power integrity work: S-parameter simulation, channel-loss budgeting & equalization, eye/jitter analysis (RI/DJ), CTLE/DFE & de-emphasis, PCB characterization up to 16 GHz Nyquist.
• Design and validate systems using high-speed interfaces (PCIe Gen5/6 at 64 GT/s PAM4 / 32 Gbps NRZ, NVMe, 10/40/100GbE, USB, SATA, DDR4/LPDDR4, HBM) and protocols (PCIe, ARINC 818, MIL-STD-1553B, ARINC 429, etc.).
• Work with FPGA/SoC platforms (AMD Ultrascale/Ultrascale+/Versal, Intel/Altera Agilex, 7-Series, Intel Xeon D/E, Atom, NXP i.MX8) including platform understanding, RTL IP awareness, programming/booting, firmware/BSP/OS bring-up, and HW-FPGA-software integration.
• Lead or contribute to feasibility studies, technical proposals (SOW/RFP), requirement capture & translation, solution positioning, competitive differentiation, and design-win generation for semiconductor, memory, and test & measurement customers.
• Support multi-board systems in enclosures, reliability/MTBF analysis, and (where applicable) aerospace/defense compliance (MIL-810, MIL-461, DO-254/DO-178).
• Collaborate cross-functionally with hardware, layout, mechanical, FPGA, and software teams; act as technical point of contact for global customers and partners.
• Represent technical capabilities at trade shows, customer meetings, and conferences (US, Europe, Asia).

Required Skills & Experience

• Strong hands-on experience in high-speed digital hardware design and product development for semiconductor/test platforms.
• Proven expertise in PCIe Gen5/6, SerDes (PAM4/NRZ), signal integrity (S-parameters, eye diagrams, equalization, jitter), and power integrity.
• Experience with EDA tools: Keysight ADS, HyperLynx (SI/PI), Cadence Allegro/OrCAD, Siemens Mentor Xpedition (or equivalent).
• Familiarity with FPGA tools (Xilinx/AMD Vivado) and board bring-up/debug.
• Knowledge of form factors: PCIe CEM, Open VPX (VITA 65/46), VNx+, XMC, FMC.
• Experience with protocol analyzers/exercisers, NVMe SSD validation platforms, and high-speed test equipment (scopes/AWGs to 67 GHz preferred).
• Ability to translate complex customer requirements into system solutions, author technical proposals, and support pre-sales / design-win activities.
• Strong system-level ownership across architecture, hardware, FPGA/RTL awareness, firmware, and integration.
• Excellent communication skills for global customer engagement (USA, Europe, Asia). Valid travel documents (B1/B2, Schengen) are a plus.

Preferred / Nice-to-Have

• Background in aerospace/defense avionics (MIL-STD-1553B, ARINC 429/818, multi-function displays, VPX SBCs).
• Experience managing or mentoring hardware/layout teams.
• Prior design wins with Tier-1 semiconductor, memory, or test & measurement companies.
• Familiarity with AI/LLM tools for technical research, documentation, and proposal support.

Education

Diploma or Bachelors equivalent in Electronics& Communication Engineering (or related field). Higher qualifications or professional certifications are advantageous.

Skills

Signal Integrity, point of contact for clients, Team Mentoring, Analog, RF, ARM, Hardware delivery, Manufacturing Processes, Documentation, Board Layout, Circuit Design, Characterization, Competitive Differentiation, IC, ARINC 429, Layout, Electronics, Enclosure Design