Location
In office (Singapore)
Seniority
Middle · 2+ years exp
Visa
Sponsors visas in United States; no register of this country names it
Confirmed on the employer's own hiring board on Nov 9, 2026. First seen by Alion on Nov 6, 2026. Mattson Technology, Inc. scores B on the Alion truth index.
Overview
Company
Impact
Profile match
We design, manufacture, market and globally support semiconductor wafer processing equipment used in the fabrication of integrated circuits.
Key Responsibilities:
- Generate mechanical design concepts and feasibility studies for making proposals for new CES/CIP/R&D project requests.
- Conduct and participate in formal/informal design reviews to contribute and generate discussion/alternate ideas on various aspects of the design.
- Perform engineering analysis of complex scope, in the following areas: Wafer transfer methods including robotics, friction, particle control, vacuum and end effectors, Mechanism design in assemblies such as slit valves, lift pins, indexers, Wafer temperature management (in both process and transfer environments) including cooling stations, pedestals, ESC.
- Design, development, and implementation of custom mechanical tooling, fixturing, and associated processes to enable the handling, assembly and/or disassembly of parts, components, sub-assemblies and final assemblies throughout the product life cycle.
- Generate solid models in 3D (parts and assemblies), 2D drawings, bills of material, submitting ECO’s, test specifications, functional specification, and product specifications.
- Manage communications and expectations with internal and external customers and vendors to ensure accomplishing project objectives.
- Work intensely with SAP, Pro-E, and other software applications to properly manage and document projects.
- Can work hands-on when needed in the engineering lab and manufacturing to support the installation and test of CES/CIP designs that get delivered on customer systems.
The job incumbent should possess:
- Knowledge of mechanical engineering design, mechanics, and material science concepts and techniques, including proficiency in solving engineering problems using analytical techniques and engineering knowledge such as thermodynamics, heat transfer, measurement control, stress analysis, Finite Element
- Analysis, or system integration
- Experience in the areas of robotics, mechanisms, RF, Plasma, gas delivery, vacuum, temperature control and electrostatic clamping
- General knowledge of appropriate materials, components and technologies used in the semiconductor equipment industry.
- Understands and applies the principles of vacuum technology.
- High level experience with CAD tools (in particular CREO) and SAP
- Requires skills in change management, problem solving, communication skills, customer orientation, product technology, global business perspective, personal effectiveness, project management, team skills and quality.
- Ability to work under pressure to design cost effective solutions with serviceability and manufacturability.
- Must be able to work in a theoretical domain or hands on practical situation.
- A Bachelor or master’s in mechanical engineering and at least 2 years directly related experience, or equivalent.
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