(2027 Intern) – Package Architect

MediaTek is the world’s fifth largest fabless IC design company, offering a diverse range of products for AI, smartphones, smartwatches, tablets, WiFi, TV, Automotive, data center processing and interconnect, voice assistant devices, drones, navigation systems and so on, most of which have the biggest market share in the world. At MediaTek, we foster a diverse and supportive culture that empowers employees to achieve their ultimate potential. We are ranked second in Newsweek's 2024 list of the World's Most Trustworthy Companies for Technology Hardware and one of Forbes’ World’s Best Employers 2024.

Are you a recent graduate with a passion for cutting-edge technology? Do you dream of working on groundbreaking projects that shape the future of data centers, AI, and high-performance computing? If so, we have an exciting opportunity for you! Our Data Center Product Architecture and Technology team is at the forefront of innovation, developing state-of-the-art architecture and technology solutions for data centers that power cloud infrastructure and the rapidly growing AI industry. We are a fast-growing, dynamic team dedicated to pushing the boundaries of technology.

Location: San Jose, California (on-site) or Portland, Oregon (on-site)

Job Description

• Develop and evaluate packaging solutions for next generation data center and AI silicon products.
• Signal and Power integrity analysis for high speed interfaces. Power deliver network design and analysis for next generation XPUs.
• Collaborate with cross functional teams to improve packaging solution in key vectors including performance and form factor.

• Understand Industry and technology trends.