Co-Packaged Optics (CPO) Reliability Sr. Staff/Principal Engineer

You will be responsible for defining accelerated testing methodologies, evaluating complex thermal/mechanical interfaces, and ensuring the seamless integration of optoelectronic components within advanced multi-die architectures.

Key Responsibilities

• CPO Architecture Qualification: Architecture and execute comprehensive qualification plans at the module and system levels, ensuring strict compliance with GR-468 (Telcordia) and relevant JEDEC standards tailored for co-packaged environments.
• Advanced Packaging Reliability: Characterize and model the Reliability Failure Modes of Silicon / Packaging specifically targeting high-density 2.5D / 3D packaging, Multi-Chip-Modules (MCM), and ultra-dense electrical/optical interfaces.
• Component De-risking: Partner with design teams early in the NPI phase to establish Design for Reliability (DfR) and execute FMEA / DFMEA to mitigate risks associated with integrated Optical Engines, PIC (Photonic Integrated Circuits), and high-power III-V laser sources.
• Reliability Lifetime Modeling: Develop physics-of-failure and Reliability lifetime Modeling frameworks to evaluate wear-out mechanisms such as thermo-mechanical fatigue, electromigration, and optical degradation under mission-critical data center use conditions.
• Statistical Analysis & FIT Tracking: Utilize statistical software like JMP to analyze parametric drift, accelerated life testing (ALT) data, and calculate product FIT (Failures in Time) and MTBF metrics.
• Failure Analysis & RMA: Own root-cause failure analysis (FA) for qualification failures and field returns (RMA), leveraging advanced analytical tools to identify material, process, or design marginalities.
• Supply Chain Collaboration: Work closely with external ecosystems, including OSAT partners, contract manufacturers (CM), and foundry suppliers, to standardize test methodologies and audit factory-level quality controls.