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Salary
≈ $30k – $62k per year (Estimated)
Location
In office (Hsinchu)
Seniority
Architect

Confirmed on the employer's own hiring board on Oct 16, 2026. First seen by Alion on Aug 3, 2026. MediaTek scores A on the Alion truth index.

Overview
Company
Impact
Profile match
MediaTek Inc. is a global fabless semiconductor company specializing in system-on-chip (SoC) architectures and digital multimedia processing technologies. The enterprise designs and markets integrated circuits for smartphones, smart home devices, IoT hardware, wireless connectivity solutions, automotive electronics, and custom AI chips for edge and cloud applications. Headquartered in Hsinchu, Taiwan, the organization operates an international network of research, development, and sales offices serving original equipment manufacturers (OEMs) and technology brands worldwide.
Role Summary

We are seeking a highly experienced and visionary Datacenter Compute SoC Architect to lead the definition, design, and optimization of our next-generation high-performance computing SoCs. In this critical role, you will be responsible for defining the system-on-chip architecture for scalable datacenter processors, balancing Power, Performance, and Area (PPA) constraints while meeting aggressive cloud-scale workloads.

You will work cross-functionally with CPU/Compute core architects, IP designers, performance modeling teams, and software/firmware engineers to deliver world-class silicon that powers the future of cloud computing and AI infrastructure.

Key Responsibilities

  • SoC Architecture Definition: Lead the architectural definition of next-generation datacenter Compute SoCs, including core/instance counts, cache hierarchies, coherent interconnects, and memory subsystems.
  • IP Selection & Integration: Define requirements and drive decisions for third-party and internal IPs (e.g., PCIe Gen 5/6, CXL, DDR5/HBM controllers, Network-on-Chip/NoC, and security enclaves).
  • PPA Optimization: Conduct rigorous Power, Performance, and Area (PPA) trade-off analysis to ensure the SoC meets strict datacenter efficiency and performance-per-watt targets.
  • Advanced Packaging Strategy: Collaborate with packaging teams on multi-die/chiplet-based architectures, die-to-die (D2D) interconnect protocols (e.g., UCIe), and advanced thermal solutions.
  • HW/SW Co-Design: Partner closely with firmware, OS, and cloud infrastructure software teams to ensure the hardware architecture optimally supports modern hypervisors, cloud-native workloads, and virtualization technologies.
  • Performance Modeling: Work with the performance modeling team to define use cases, guide the creation of C++/SystemC architectural models, and analyze simulation data to identify bottlenecks.
  • Technical Leadership: Write detailed architecture specifications and serve as the technical lead during the RTL implementation, verification, and silicon bring-up phases.

#LI-JK1

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