Principal Engineer, NAND Advanced Thin Films Process Development
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn,communicateand advance faster than ever.
Position Overview
The Principal Engineer in Process Development -Advance Thin film plays a critical leadership role in the strategic advancement and implementation of sophisticatedstructural and electricalfilm processes for NAND memory technology. This positionis responsible fordefiningtechnicaldirection, fostering innovation, and ensuring the successful integration of new processes into manufacturing. The Principal Engineer works collaboratively across multiple teams, contributes to the establishment of technology roadmaps, and delivers solutions that drive next-generation device scaling while supporting the organization’sobjectives.
Key Responsibilities
Define and implement the technical strategy for structural and electrical film process development, ensuring alignment with both business and technologyobjectives.
Lead multi-functional teams in the development, integration, and scaling of thin film processes specifically tailored for advanced NANDstructures anddevices.
Oversee the end-to-end development of process modules, with a strong focus on manufacturability, scalability, and readiness for integration.
Resolve complex technical challenges that have significant business implications, including root cause analysis and mitigation of process/device failures.
Mentor senior engineers and influence the technical direction throughout the organization, fostering a culture of technical excellence and innovation.
Represent the function in technical forums andparticipatein strategic collaborations, including industry consortia, technical conferences, and joint development projects.
Deliver solutions that enable andmaintaina competitive leadership position in advanced memory technology, including benchmarking against industry standards.
Drive technology transfer and ramp-up activities, ensuring seamless transition from R&D to high-volume manufacturing.
Identifyand evaluate emerging trends, risks, and opportunities instructural and electric filmtechnology, providing recommendations for future investments and critical initiatives.
Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and materialutilization.
Technical Expertise
Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications.
In-depth knowledge of process-deviceand mechanicalinteractions, challenges associated withtechnology/device scaling, and the principles of reliability engineering for next-generation memory nodes.
Proventrack recordof developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems.
Expertisein advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).
Strong foundationinthin film process developmentusing plasma and thermalmethods,especially fordielectric(includinglowKandhighKfilms),carbon-basedfilms, with an ability to analyze structural-process correlations and conduct failure analysis.
Experience in benchmarking technology, conducting competitive analyses, and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements.
Ability to lead cross-disciplinary teams in the development and deployment of new process technologies, including collaboration with integration, device, reliability, and manufacturing engineering groups.
Proficiencyin statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.
Experience with regulatory compliance, intellectual property management, and technical documentation in a semiconductor manufacturing environment.
Qualifications
PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, ora relatedfield.
5-10 years of experience in Thin Film research and development for NANDprocess, specifically including CVDand Diffusion ThinFilms.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
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