PRINCIPAL ENGINEER, NAND PI

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Principal Engineer in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
• Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production.
• Design Experiments: Design and implement device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Multi-functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across multi-functional teams to enable a project to proceed in a rapid and low error manner.
• Technology Transfer: Support the transfer of new technology from R&D to high volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on-job training and training class.

Successful candidates for this position will have:

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and capacity to collaborate within multi-functional teams.

Requirements:

Education:

• PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or related field with semiconductor industry experience
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.

• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in R&D and technology transfer within Semiconductor industry
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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