Packaging Engineer

Microsoft’s Quantum Systems organization is a multidisciplinary organization advancing cutting-edge quantum technologies to address some of the world’s most complex challenges. We are seeking a Packaging Engineer with a focus on mechanical simulation. This is a unique opportunity to shape the future of quantum systems in a dynamic, mission-driven environment.

At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum .

Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.

We are looking for a Packaging Engineer with a focus on mechanical simulation. Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials.

Responsibilities

Responsibilities

• Thermal, structural, and thermo-mechanical simulations for quantum packaging hardware, including substrates, interposers, chip attach, cryogenic fridge components, and supporting cryogenic structures.
• Develop simulations that span hand calculations, reduced-order models, and full finite-element analysis (FEA) depending on fidelity and program needs.
• Structural and thermo-mechanical simulations to assess CTE mismatch, interfacial stress, warpage, and deformation across thermal cycles.
• packaging reliability assessments, including risks associated with flip-chip attach, solder joints, substrate bonding, and PCB interfaces.
• Generate and maintain reusable simulation templates, material libraries, and modeling workflows to improve consistency and efficiency across the packaging team.
• Work in teams or independently as required.
• Embody our Culture and Values

Qualifications

Qualifications

Required/Minimum Qualifications

• Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience
  • OR equivalent experience

Other Requirements

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screening
  • Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
• Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).
• Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI

Additional/Preferred Qualifications

• Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
  • OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience
  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience
  • OR equivalent experience
• Experience with cryogenic or extreme-environment hardware (cryogenic, vacuum, low-vibration, or high-precision systems).
• Proficiency with FEA tools such as ANSYS, COMSOL, Abacus, or equivalent, including model setup, meshing strategies, and convergence assessment
• Familiarity with advanced packaging technologies (flip chip, substrates, interposers, solder joints, PCB attach).
• Experience correlating simulation with cryogenic test data and iterating models based on measurement feedback.
• Strong fundamentals in heat transfer, solid mechanics, and numerical methods.
• Demonstrated ability to translate ambiguous design questions into well-scoped simulation problems and actionable outputs.

#Quantum #QuantumCareers #MDQCareers

Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:

https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.