Senior Packaging Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and elivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Packaging Technology & Manufacturing Engineer to join the team to support our mission as a key role in areas related to silicon packaging manufacturing operations, quality and reliability.

#SCHIE #CSME #SMPE

Responsibilities

The candidate for this position will be expected and able to complete the following responsibilities:

ThePackaging Engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product. In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.

Specific responsibilities to include:

Package Development & Production Ramp

• Drive package development and manufacturing readiness from engineering builds through qualification and production ramp.
• Define and maintain package manufacturing specifications, process requirements, control limits, and readiness criteria.
• Lead OSAT technical engagement, including process reviews, development checkpoints, manufacturing readiness assessments, and technical audits.
• Monitor manufacturing and test-vehicle data to identify package/process risks and accelerate learning during development.
• Drive structured ramp management, ensuring package technology, process capability, yield, quality, and capacity are ready for volume production.

High-Volume Manufacturing & Sustaining

• Provide technical oversight of OSAT and supplier performance across package assembly and related manufacturing processes.
• Monitor package yield, process health, quality indicators, and manufacturing excursions.
• Lead technical root-cause analysis and corrective/preventive actions for package-related yield, quality, and reliability issues.
• Drive excursion prevention, containment, disposition, and continuous improvement with suppliers and cross-functional teams.
• Support product change management, including technical assessment and risk evaluation of manufacturing changes.
• Establish supplier and OSAT technical checklists, audit criteria, and ongoing manufacturing health reviews.

Quality & Supplier Management

• Drive package quality assurance in partnership with supplier quality and manufacturing teams.
• Conduct regular supplier technical reviews, onsite assessments, process audits, and technology-development engagements.
• Ensure supplier manufacturing processes meet product quality, reliability, yield, and production requirements.
• Identify gaps in OSAT capability and drive closure plans ahead of production ramp.

Qualifications

Required Qualifications:

• BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Packaging Engineering, or a related technical discipline.
• Significant industry experience in semiconductor packaging, assembly, process engineering, package development, or manufacturing.
• Demonstrated experience taking advanced package technologies from development through qualification and high-volume production.
• Strong experience working directly with OSATs and external manufacturing partners.
• Demonstrated ability to solve complex package/process/yield/reliability issues using structured technical analysis.
• Strong communication skills with the ability to influence suppliers and cross-functional engineering organizations.
• The ideal candidate will bring strong expertise in:
  • Advanced semiconductor packaging technologies and manufacturing processes.
  • Package architecture and package design fundamentals.
  • Assembly technologies, materials, process integration, and manufacturing controls.
  • OSAT manufacturing and supplier technical management.
  • Package design-for-manufacturing and design-for-reliability.
  • Product introduction, qualifications, production ramp, and high-volume manufacturing.
  • Yield analysis, process capability, excursion management, root-cause analysis, and corrective actions.
  • Package reliability and failure mechanisms.
  • Cross-functional technical leadership across silicon, package, test, quality, manufacturing, and system teams.

Screening Requirements

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.