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Salary
≈ $56k – $99k per year (Estimated)
Location
In office (Sunnyvale)
Seniority
Middle

Confirmed on the employer's own hiring board on Oct 28, 2026. First seen by Alion on Oct 21, 2026. Nokia scores A on the Alion truth index.

Overview
Company
Impact
Profile match
Nokia is a Finnish telecommunications equipment company founded in 1865 as a paper mill, which became the world's largest mobile phone maker in the 1990s before selling that business to Microsoft in 2014. It now supplies network infrastructure to operators and enterprises, covering radio access equipment for mobile networks, optical and IP routing for transport networks, fixed broadband access, and a technologies division that licenses its cellular patent portfolio. Headquartered in Espoo and listed in Helsinki and New York, it runs Nokia Bell Labs as its research arm and has been expanding into data centre networking as operator spending has slowed.

Job Family Description

Brief Description

Assembly Engineering Technician responsible for supporting Assembly Engineering team in development assembly builds and sustaining processes and tools in a 24x7 manufacturing & development facility specializing in optical integrated circuits. Job will focus on weekend work days/hours but additional off-hours and weekday support may be required to sustain the 24x7 nature of the tools/processes owned.

Description

Responsibilities will include engineering support in sustaining and monitoring performance of die singulation, die attach, wirebond and inspection tools and/or process steps in the fabrication of monolithically integrated optical circuits.

Candidate is expected to be hands-on and able to operate all process tools required in the assembly of next generation development builds. Candidate will be assisting Assembly Engineers in running experiments, data collection and analyzing data.

Candidate will work in a team environment consisting of engineers and operators, requiring excellent written and verbal communication skills. Responsibilities will also include assisting in maintaining operational documents and training new operators.

Responsibilities will include engineering support in sustaining and monitoring performance of die singulation, die attach, wirebond and inspection tools and/or process steps in the fabrication of monolithically integrated optical circuits.

Familiarity with cleaving singulation, die-attach and wirebond assembly process related defects. Knowledge in identifying or addressing common causes of assembly defects is a plus. Experience with SPC and MES systems is a plus.

Experience in III-V semiconductors is desired.

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