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As a technology leader across mobile, fixed and cloud networks, our solutions enable a more productive, sustainable and inclusive world.
We are seeking a high-caliber Principal Engineer to provide technical leadership and operational expertise in semiconductor laser testing and Burn-In (BI) operations. Experience with Photonic Integrated Circuits (PICs) is highly advantageous. In this pivotal role, you will oversee die-level optoelectronic testing and BI operations. You will collaborate with multidisciplinary teams to design and execute strategies that ensure high-efficiency, low-cost, and scalable PIC testing in volume manufacturing.
- Capacity Planning: Own PIC test and BI capacity planning; develop scalable manufacturing strategies for internal facilities and external Contract Manufacturing (CM) partners.
- Equipment Development: Support new test and BI equipment design from early phases; champion Design for Manufacturing (DFM) best practices across quality, scalability, maintainability, and cost.
- Continuous Improvement: Partner with R&D and Product Integration teams to drive continuous improvement in yields, cycle times, and capital expenditures.
- Vendor Management: Develop and manage relationships with equipment vendors and contractors throughout development and capacity ramp cycles.
- CM Transfer & Deployment: Lead projects with external CM partners to co-develop and transfer test and BI equipment, overseeing full-scale deployment at CM sites.
- Cross-Functional Interface: Act as the primary technical bridge between Nokia Operations, R&D, and CM partners to resolve volume production issues.
- Operational Strategy: Define long-term resource strategies to optimize internal operations for demanding production schedules and New Product Introduction (NPI) coverage.
- Education: Master’s or Ph.D. in Electrical Engineering, Physics, Optical Sciences, or a related discipline.
- Industry Experience: 10+ years in high-volume semiconductor laser manufacturing, testing, and reliability.
- Technical Expertise: Proven track record in die-level test/BI equipment development and managing equipment contractors.
- Global Operations: Demonstrated success transferring and ramping high-volume manufacturing capacity with global CM partners.
- Leadership: 5+ years of direct engineering management or technical project leadership experience.
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