Salary
≈ $77k – $145k per year (Estimated)
Location
In office (Plano)
Seniority
Senior · 7+ years exp
Confirmed on the employer's own hiring board on Nov 1, 2026. First seen by Alion on Aug 26, 2026. Nokia scores A on the Alion truth index.
Overview
Company
Impact
Profile match
Nokia is a Finnish telecommunications equipment company founded in 1865 as a paper mill, which became the world's largest mobile phone maker in the 1990s before selling that business to Microsoft in 2014. It now supplies network infrastructure to operators and enterprises, covering radio access equipment for mobile networks, optical and IP routing for transport networks, fixed broadband access, and a technologies division that licenses its cellular patent portfolio. Headquartered in Espoo and listed in Helsinki and New York, it runs Nokia Bell Labs as its research arm and has been expanding into data centre networking as operator spending has slowed.
Backed by Oak Investment Partners, Mercury Fund
The Senior Thermal-Mechanical Engineer will play a crucial role in our team, leading the development and integration of aerospace and space communications equipment. With a primary focus on RF communications, this role involves designing thermal-mechanical solutions for high-performance electronics, including SpaceVPX/VITA-based systems. The successful candidate will have extensive experience in thermal management, structural analysis, and environmental qualification, ensuring our equipment meets the demanding requirements of aerospace and space environments.
- Lead thermal-mechanical architecture and detailed design for aerospace communications equipment, with a focus on RF systems.
- Design thermal management solutions for high-power RF amplifiers, processors, and other high-density electronics.
- Develop mechanical packaging and thermal solutions for SpaceVPX and VNX-based systems, ensuring optimal performance and reliability.
- Perform thermal, structural, and thermo-mechanical analysis, including steady-state and transient thermal analysis, and modal analysis.
- Design and optimize heat sinks, cold plates, and thermal interface materials to enhance heat dissipation.
- Work closely with multidisciplinary engineering teams, including RF, electrical, and systems engineers, to ensure seamless integration.
- Lead and support TVAC, shock, and vibration qualification testing, ensuring our equipment meets the highest standards.
- Take ownership of hardware development, from concept to production, ensuring timely and successful project delivery.
- Mentor junior engineers and provide technical leadership, fostering a culture of continuous improvement.
- Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a related field is required.
- 7+ years of relevant thermal-mechanical or mechanical engineering experience, with a strong focus on aerospace or space applications.
- Expertise in thermal management of electronic, RF, and communications equipment is essential.
- Hands-on experience with SpaceVPX, VNX, and VPX architectures is highly desirable.
- Proficiency in FEA and thermal analysis tools, such as ANSYS or Abaqus, is a must.
- Demonstrated experience in TVAC, thermal cycling, shock, and vibration qualification testing.
- Strong understanding of mechanical packaging, GD&T, and manufacturing processes.
- Ability to work effectively in a multidisciplinary team, collaborating with RF, electrical, and systems engineers.
- Excellent problem-solving and analytical skills, with a track record of delivering complex engineering projects.
- U.S. Citizenship or Permanent Residency (Green Card) is strongly preferred, with authorization to work in the U.S.
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