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Nokia is a Finnish telecommunications equipment company founded in 1865 as a paper mill, which became the world's largest mobile phone maker in the 1990s before selling that business to Microsoft in 2014. It now supplies network infrastructure to operators and enterprises, covering radio access equipment for mobile networks, optical and IP routing for transport networks, fixed broadband access, and a technologies division that licenses its cellular patent portfolio. Headquartered in Espoo and listed in Helsinki and New York, it runs Nokia Bell Labs as its research arm and has been expanding into data centre networking as operator spending has slowed.
As a Staff Process Integration Engineer, you will be responsible for ensuring high-quality, stable production of InP-based Photonic Integrated Circuit (PIC) products. This role is hands-on and data-driven, focusing on process analysis, experiments and cross-functional problem solving. You will play a key role in ramping a new high-volume manufacturing fab and driving continuous improvements in yield, reliability, and manufacturability.
You will collaborate closely with Process Engineering, Operations, and Technology Development teams to troubleshoot issues, qualify process improvements, maintain test structure designs, and support next-generation PIC platforms.
- Troubleshoot and resolve process deviations and test failures through detailed analysis of process history and test data
- Establish, document, and maintain inline FAB process specifications
- Continuously monitor inline FAB process capability (CPK) and identify risks
- Analyze the impact of design rules on process yield and performance; develop and maintain test structures for effective process control
- Lead yield improvement initiatives from problem definition through qualification and production implementation
- Support next-generation PIC platform development, including technology development, transfer, and manufacturing ramp activities
- Collaborate with Process Engineering to improve process stability, robustness, and capability
- Partner with Operations to improve fab throughput, cycle time, and overall manufacturing efficiency
- M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science, or a related field
- Strong understanding of semiconductor processes and device physics
- Hands-on experience working in a semiconductor wafer fab with experience on III-V semiconductor wafer processes, including epitaxy, wet etching, plasma etching, metal deposition, and photolithography
- Working knowledge of statistical process control (SPC) methodologies
- Experience with database interrogation, statistical data analysis, and design of experiments (DOE)
- Excellent communication skills, with the ability to clearly present data, insights, and recommendations to cross-functional and executive audiences
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