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Salary
$14k – $30k per year (Estimated)
Location
In office (Kuala Lumpur)
Seniority
Senior · 5+ years exp
Employment
Full-Time
Overview
Company
Impact
Profile match
NXP Semiconductors is a Dutch chipmaker established in 2006 when Philips spun out its semiconductor division, and it concentrates on embedded processing rather than general purpose computing. Its largest market is automotive, where it supplies radar sensors, vehicle networking, battery management and the secure processors behind keyless entry and digital car keys, alongside industrial and internet of things microcontrollers, mobile secure elements and communications infrastructure silicon. Headquartered in Eindhoven and listed on Nasdaq, it is one of the leading suppliers of near field communication and automotive processing chips in the world.
  • Die Attach Equipment Technician specialist and vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must and preferable also have experience on Hanwha Die Attach equipments.
  • Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
  • Perform equipment setup or conversion for any product changes for Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
  • To able to work independently to identify, sustain, purchase, find second source for Die Attach integrated critical spare and tooling.
  • To maintain/sustain equipment performance to meet define goal.
  • Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.
  • To maintain the machine performance, address the problem root cause and solve quality issue cause by the machine.

Compensation Details

  • Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.
  • Manage the maintenance activities of machines and fabrication of spare parts.
  • Good discipline and tardiness with minimum supervise

Requirement

  • Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment
  • Experience in semiconductor assembly and applied statistics will be an advantage
  • Have good technical skills on Front and Back End assembly equipment
  • Strong interpersonal and communication skills
  • Good decision making / problem solving skills.
  • Familiar with production environment & possesses process handling knowledge. (Semiconductor).
  • Must be discipline and willing to work long hours and shifts.
  • Must adhere NXP Total Quality Mindset and Safety Awareness.
  • Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.
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