Internship - Understanding the reliability of advanced laminate-based electronic packages at NXP
Understanding the reliability of advanced laminate-based electronic packages at NXP
We are looking for a highly motivated student that will help us with investigating and understanding the boundaries of the reliability of advanced laminate-based electronic packages with complex multi-material interfaces. These packages may be exposed to humidity with electrical bias and/or thermo-mechanical loading over long durations. It is essential to understand the underlying degradation with failure analysis techniques and failure mechanisms in order to assess the reliability of these systems in real-world applications (e.g. automotive and industrial).
Your team
This opportunity is within the Product Quality & Diagnostic Center (PDQC) team. PDQC’s mission is to ensure robust product quality and reliability throughout development and qualification, enabling successful introduction of new technologies into production. PDQC accomplishes this mission through several key objectives:
·Drive product qualification and reliability assessment for new technology developments.
·Support failure analysis and root cause understanding across development and qualification phases.
·Define and implement reliability test methods, hardware, and evaluation strategies.
·Enable continuous improvement of product robustness through data-driven insights and collaboration.
What’s in it for you
·A great opportunity to develop your skills (technical, soft skills, communication, etc.).
·Gaining experience in a multinational and diverse environment.
·Working on real assignments which contribute to NXP’s objectives.
Your Profile
·Internship for Master of Science in Microelectronics
·Affinity with semiconductor, reliability and physics.
·Team player, willing to work in international and multi-disciplinary teams.
·Flexible and able to multi-task.
·Excellent communication skills, both verbal and written in English.
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