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Salary
$30k – $80k per year (Estimated)
Location
In office (Bengaluru)
Seniority
Principal · 10+ years exp
Employment
Full-Time
Overview
Company
Impact
Profile match
NXP Semiconductors is a Dutch semiconductor manufacturer headquartered in Eindhoven and founded in 2006 as a spin-off from Philips. The company designs and produces a wide range of products including microcontrollers, application processors, communication processors, analog and power management devices, and connectivity solutions. It operates globally with manufacturing facilities and research centers across Europe, Asia, and the Americas, primarily serving the automotive, industrial, IoT, and mobile markets.

We are looking for a Principal HW DFT Engineer who will architect, implement, and validate in-vehicle networking devices as part of NXP’s Automotive grade products. You will be responsible for advanced test strategies and implementation, verification and validation of pre/post tapeout of DFT features, overall test coverage improvements, and work closely with RTL and physical team on DFT timing constraints and closures.

Main Job Tasks and Responsibilities:

  • Architecture & Strategy: Define and implement advanced DFT strategies, including Scan Architecture, JTAG, Memory BIST (MBIST), and Logic BIST (LBIST)

  • Implementation & Verification: Lead the integration of digital subsystems, perform scan insertion, and generate ATPG (Automatic Test Pattern Generation) patterns while ensuring high fault coverage.

  • Silicon Support: Drive post-silicon validation and debug activities to root cause failures and improve manufacturing test efficiency.

  • Collaboration: Coordinate with physical design and test engineering teams to ensure timing closure and that test patterns are operational immediately upon silicon arrival.

Minimum Required Qualifications

  • Education: B.S./M.S. Electrical/Computer Engineering (or similar degrees)

  • Experience: Typically requires 10+ years of industry experience in SoC DFT implementation, verification, static timing closure, test coverage analysis and improvement, and silicon bring-up on ATE

  • Tool Expertise: Proficiency with industry-standard EDA tools from Mentor Graphics/Siemens (Tessent), Cadence, or Synopsys

  • Technical Skills:

  • DFT - Scan insertion and architecture, ATPG: Proficiency in generating test vectors to detect manufacturing faults like stuck-at, transition, and advanced faults, Built-In Self-Test (BIST): Integration of Memory BIST (MBIST) for embedded SRAM/ROM and Logic BIST (LBIST) for autonomous logic testing, Boundary Scan & JTAG, Test Compression: Implementing techniques to reduce test data volume and application time, which is critical for large System-on-Chip (SoC) designs.

  • Hardware Design & Implementation - HDL Proficiency: Strong command of Verilog or SystemVerilog for modifying RTL to insert test logic and writing test wrappers. Timing & Constraints: Knowledge of Static Timing Analysis (STA) and creating DFT-specific timing constraints (SDC files) to ensure test logic does not degrade functional performance.

  • Verification & Debug - Simulation: Conducting gate-level simulations (GLS) and verifying DFT logic for correctness before fabrication. Post-Silicon Debug: Analyzing silicon data from Automated Test Equipment (ATE) to diagnose failures and improve manufacturing yield.

  • Software & Tool Proficiency - EDA Tool Suites: Mastery of industry-standard tools such as Synopsys TestMAX/DFT Compiler, Mentor Graphics Tessent, and Cadence Modus. Scripting & Automation: Expertise in Tcl, Python, or Perl to automate test insertion flows, run simulations, and parse coverage reports.

More information about NXP in India...

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