Salary
≈ $30k – $64k per year (Estimated)
Location
In office (Bangkok)
Seniority
Middle · 3+ years exp
Employment
Full-Time
Overview
Company
Impact
Profile match
NXP Semiconductors is a Dutch chipmaker established in 2006 when Philips spun out its semiconductor division, and it concentrates on embedded processing rather than general purpose computing. Its largest market is automotive, where it supplies radar sensors, vehicle networking, battery management and the secure processors behind keyless entry and digital car keys, alongside industrial and internet of things microcontrollers, mobile secure elements and communications infrastructure silicon. Headquartered in Eindhoven and listed on Nasdaq, it is one of the leading suppliers of near field communication and automotive processing chips in the world.
Job Summary:
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.
Job Responsibility
- Define/optimize procedures to ensure smooth processing of production lots
- Develop and maintain process documentation and SOPs including operator training
- Lead root cause analysis for defects and yield losses
- Provide disposition on lots with quality issues
- Support new product introduction and process qualification
- Analyze production data to identify process improvements
- Collaborate with cross-functional teams on cost reduction and process improvement projects
- Perform change management including new material qualification
Qualification
- Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
- 3-5 years of process engineering experience with standard backgrindand dicing before grinding (DBG) process.
- Strong data analysis and problem-solving skills.
- Experience with Statistical Process Control (SPC) and process validation (preferred).
- With good command of English language.
- Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
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