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In office (Suzhou)

Confirmed on the employer's own hiring board on Nov 3, 2026. First seen by Alion on Nov 3, 2026. onsemi scores B on the Alion truth index.

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Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.

Be a technical engineer/leader of new product introduction (NPI) for wirebonding (AU/CU WB) process under ATNPI-FOL. Take full ownership on assigned process to set-up, validate and detect risk according to six-sigma capability and manufacturability, communicate to direct manager or stakeholders and mitigate risks to meet project quality, cost, yield, and delivery.

Responsible for FOL AU/CU WB for NPI development projects and post code-s activities

  • Follow projects APQP phase requirements, provide documentation, line training and respond to internal and external customers
  • Provide technical advice to development engineer/ leader (ATPDG and ATNPI technical lead) as well as other cross-functional team regarding process design, tooling design and process control to reduce the potential risk items impact to quality, yield, cost and delivery
  • Attend design reviews to brainstorm, analyze, and highlight design potential risk to mass production
  • Review build diagram of new products and derivative products compliance to design rule specs, manufacturability and lessons learned
  • Responsible to raise technical constraints which will have major impact to project quality, cost, yield, and delivery
  • Responsible to secure POR /BOM to meet NPI and BE manufacturing KPI requirements
  • Review, validate, accept / reject design concept from the technology group and package development for new product introduction from design review APQP Phase zero
  • Review, validate, accept / reject characterized POR (process flow, material and process parameters) established by ATPDG PE based on manufacturing capability on or before line certification
  • Ensure project documents, engineering reports, work-instruction, OCAP procedure, process parameters, bin limit, tooling drawings are reviewed and draft are uploaded to database every phase as well as finalized before product release
  • Conduct training to manufacturing, process engineer, technician, operator, and trainer designate before line validation or line certification
  • Be responsible to create mitigation plan involving cross-functional team to quickly resolve issues found during line certification/safe launch/post code-s for the derivative devices
  • Provide report and share to related persons closed loop activities for continuous improvement of NPI by lesson learn, Design rule revision and APQP deliverable update
  • Involves PE team for post code S activities on quality, yield and cost to ensure smooth handover until the project hands over
  • Host buy off and hands over meeting with process engineering and cross-functional team to present post code S monitor results of yield trends, failure modes with pareto analysis, maverick MRB history, actions, LRR, RMP, compare to Line certification.
  • Responsible to hold MRB meeting when for line shut down by maverick, QCN, OCAP, RMP failure potential failure mode caused by/potentially caused by owned process and provide report and update together with related document in control database
  • Responsible to generate 8D report for PQA related to NPI product released within 2 years under ATNPI post-code s monitoring
  • Responsible to qualify automotive process and personnel, collaborates with equipment engineering and QA team to qualify automotive designated equipment.

Same Posting Description for Internal and External Candidates

  • Bachelors in Engineering preferably in the field of Materials, Mechanical or Electronics
    • Maters degree in engineering or other related discipline is a plus
  • Experience 2-3 years combined experience focused in Au/Cu wirebonding process
    • Experience in Auto vision inspection (AVI) process is a plus
  • Can independently do machine set-up and buy-off equipment especially platforms: ESEC Au/Cu wirebonder, ASM Au/Cu wirebonder, KNS Au/Cu wirebonder, or other equivalent platforms
  • Have deep understanding and hands-on experience of Au-Cu WB process, material, equipment and their interaction
  • Have practical and theoretical knowledge on APQP procedure, DFMEA, PFMEA, Control Plan, DOE
  • Have good statistical analysis and decision making skills
  • Confident and fluent in oral and written both Chinese and English
  • Be able to write good technical/engineering report
  • Have good leadership, interpersonal relationship and negotiation skills
  • Positive attitude towards work, proactive, self motivated, open-minded, can work under high pressure
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