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In office (Zhubei)
Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.
Job Summary:
onsemi (Nasdaq: ON) is hiring a self-directed and self-driven GaN/BCD Process and Technology Development Engineer for external foundries.
- Process Integration:
- Collaborate with R&D and foundry to develop/optimize GaN/BCD power devices and processes to deliver device manufacturability and production yield
- Work closely with foundry and multi-functional teams to bring up NPI
- Improvement of yield and quality:
- Perform advanced device characterization
- Conduct detailed yield analysis to identify failure modes. Drive yield and quality improvement actions at defect and module levels at foundry
- Implement statistical process control (SPC) and design of experiments (DOE) methodologies to improve process yield.
- Project Management:
- Manage multiple projects, ensuring timely delivery to the solution and meet milestones.
- Coordinate with cross-functional teams to align project goals and deliverables.
Requirements:
- Education:
- MS or PhD in Electrical Engineering, Physics, or Material Science
- Experience:
- In-depth knowledge of GaN/BCD power device physics, process flow, integration and yield analysis. Module experience is a plus.
- Proven track record in new process development/optimization and/or yield improvement in GaN and BCD technologies
- Experience working with foundries RD/engineering/quality teams.
- Extensive experience with device reliability mechanisms, physical and device characterization techniques and failure analysis.
- Experience of managing a full process of new product introduction, including test chip, tapeout, IP merges, masks, to deliver 1st Silicon success, as well as enabling new technology joint development in external foundries.
- Soft Skills:
- Excellent written and verbal communication and presentation skills in English
- Strong project management abilities. Multi-tasking and good adaptability in a fast-changing environment.
- Ability to work in collaboration and in leadership.
- Self-driven, motivated, and excellent in problem solving skill with exceptional analytical and persuasion on directions.
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