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Principal Product Engineer

Cadence Design Systems • EDA Software • Semiconductor IP & Chip Design Services • Master's Degree • Python • Perl • 1 month ago

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Salary

≈ $24k – $70k per year (Estimated)

Location

In office (Zhubei)

Seniority

Principal · 7+ years exp

Employment

Full-Time

Confirmed on the employer's own hiring board on Oct 25, 2026. First seen by Alion on Sep 3, 2026. Cadence Design Systems scores B on the Alion truth index.

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Cadence Design Systems

Cadence Design Systems is an American software company founded in 1988 that supplies the electronic design automation tools engineers use to design and verify integrated circuits. Its products cover digital synthesis and place-and-route, custom and analogue design, circuit simulation with the Spectre and Virtuoso families, functional verification, and increasingly system-level analysis for packaging, thermal behaviour and computational fluid dynamics. Headquartered in San Jose and listed on Nasdaq, it also licenses design intellectual property such as processor and interface blocks, and competes primarily with Synopsys and Siemens EDA.

cadence.com • HQ: San Jose, United States • Semiconductor IP & Chip Design Services • EDA Software • 5000+ employees • Est. 1988

Tech stack of Cadence Design Systems

Backed by Sequoia Capital

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Job Description

Product Engineer for Integrity 3D-IC
Developing and integrating various EDA tools and engines into the consolidated 3D-IC platform.
Working closely with R&D group to develop, integrate and enhance EDA solutions, including 3D-IC system planning, implementation, and analysis/verification.
Collaborating with the field teams for customer engagement and providing technical support and guidance.
Communicating and coordinating with multiple R&D groups and field teams to enable EDA solutions to customers.

Position Requirements

BS degree with 7+ years or MS degree and 5+ years of engineering work experience in the semiconductor industry.
Experience in physical implementation, place-and-route, and signoff tools. Familiar with Cadence digital flows and advanced packaging design with Allegro Package Designer.
Knowledge and experience in 3D-IC system planning, implementation, analysis, and signoff flows is a plus
Hands-on experience in scripting languages, such as TCL, Perl, YAML, and Python.
Good trouble-shooting and technical documentation skills.

A self-motivated, proactive leaner and team player, with excellent communication skills and a customer-oriented attitude.

We’re doing work that matters. Help us solve what others can’t.

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