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Location
In office (Scottsdale)
Seniority
Staff · 8+ years exp
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Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.

onsemi is seeking an accomplished NPD Program Manager to lead complex New Product Development programs within the Power Solutions Group. This role is accountable for the execution of global, cross-functional programs from concept and feasibility through qualification, industrialization, and production release, with a primary focus on automotive power semiconductor products. The successful candidate will bring relevant experience in silicon carbide (SiC), insulated-gate bipolar transistor (IGBT), silicon power devices, and power modules, together with a demonstrated record of managing large-scale automotive programs. The position requires disciplined program governance, effective stakeholder leadership, proactive risk management, and consistent delivery against business, customer, quality, and schedule commitments.

Responsibilities:

  • Define program scope, objectives, requirements, deliverables, and success criteria with business, engineering, operations, quality, manufacturing, supply chain, finance, and customer-facing stakeholders.
  • Provide end-to-end leadership for large-scale automotive NPD programs spanning SiC, IGBT, silicon power devices, and power module technologies from concept through production release.
  • Develop and maintain integrated program schedules, milestone plans, resource assumptions, dependencies, critical paths, and executive-level program summaries.
  • Manage program change requests by defining the change, assessing schedule, cost, technical, quality, capacity, and customer impact, and securing appropriate approval before execution.
  • Drive phase-gate readiness and ensure required deliverables, reviews, approvals, evidence, and closure actions are completed in accordance with established NPD governance.
  • Lead global cross-functional teams to resolve technical and execution issues while maintaining alignment to schedule, scope, quality, and customer commitments.
  • Monitor program execution against plan, identify schedule pull-in opportunities, and establish recovery plans when performance deviates from committed targets.
  • Perform regular risk and opportunity management, including early identification, prioritization, mitigation ownership, contingency planning, and timely escalation.
  • Drive timely closure of critical decisions, technical trade-offs, qualification issues, manufacturing readiness gaps, supply constraints, and customer actions.
  • Manage a portfolio of strategic projects in parallel or assume full accountability for a single large-scale automotive program.
  • Maintain clear, timely, and effective communication with program teams, senior leadership, customers, and relevant stakeholders through structured governance reviews and concise reporting.
  • Document and report program status, milestone performance, risks, decisions, action items, budget status, and key changes.
  • Ensure project schedules, dashboards, action registers, risk registers, and governance records remain current and accurate.
  • Advance organizational learning and continuous improvement through formal lessons learned, root-cause analysis, and structured problem-solving methodologies, including 8D.

Competencies:

Know-how:

  • Broad technical understanding of power semiconductor products and development flows, including SiC MOSFETs, IGBTs, silicon power devices, discrete packages, and power modules.
  • Working knowledge of semiconductor wafer fabrication, device development, package development, assembly, qualification, reliability, manufacturing readiness, and product release processes.
  • Strong understanding of automotive product development expectations, including disciplined change control, qualification planning, quality documentation, customer milestones, and production launch readiness.
  • Excellent leadership and communication skills across all levels of the organization, including the ability to tailor executive presentations to different decision-making needs.
  • Expertise in waterfall and phase-gate program management methodologies, tools, and governance practices; familiarity with Agile methods is beneficial.
  • Strong analytical capability, including data gathering, schedule analysis, root-cause problem solving, and use of metrics to identify execution gaps.
  • Broad cross-functional experience in semiconductor manufacturing, product engineering, operations, quality, supply chain, and customer-facing program execution is highly valuable.

Required Skills:

  • Demonstrated ownership of large automotive programs with multiple technologies, workstreams, sites, suppliers, and stakeholders.
  • Proactive identification of schedule pull-in opportunities, execution risks, and recovery actions.
  • Ability to operate independently within established governance frameworks and make sound decisions based on technical, business, and customer inputs.
  • Proficiency in proactive risk planning and disciplined reaction to project problems to protect schedule, quality, and customer commitments.
  • Strong listening, collaboration, negotiation, conflict-resolution, and decision-facilitation skills.
  • Concise and clear written and oral communication, with strong interpersonal and executive presence.
  • Ability to lead cross-functional and cross-discipline team members without direct authority.
  • Ability to manage evolving priorities, organizational complexity, and demanding timelines while maintaining execution discipline.
  • Demonstrated ability to communicate throughout the organization, including senior and executive leadership.

Requirements:

  • Semiconductor process, device, package, module, product, or development engineering experience is required.
  • Demonstrated experience with SiC, IGBT, silicon power devices, and power modules is strongly preferred.
  • Minimum 8 years of semiconductor or power electronics industry experience, including at least 5 years of project or program management experience, or roles with a strong program-management component.
  • Proven experience managing large, complex automotive New Product Development programs through qualification, industrialization, and production launch.
  • Bachelor’s degree in engineering, science, or related technical field; master’s degree preferred.
  • A demonstrated record of progressively responsible assignments and measurable business or program outcomes is required.
  • Project Management Professional (PMP) certification or equivalent formal program management training is a plus.
  • Proficiency in Microsoft Excel and PowerPoint. Proficiency in Microsoft Project or comparable scheduling tools is strongly preferred.
  • Ability to work effectively across global teams, time zones, manufacturing sites, and customer organizations.
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