Location
In office (Zhubei)
Seniority
Staff · 8+ years exp
Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.
Job Description of Principal Reliability Engineer of ON Semiconductor at Taiwan
We are now looking for a Principal Reliability Engineer. The position is an individual contributor role, working with the NPD cross functional teams for NPD projects and BE Ops/PKG/TE for MP projects.
- For NPD projects, the engineer is to work with Design, Technology, PI, PE, TE, and PKG to develop, to document and to execute the reliability strategy and qualification plans for new product development. Participate weekly NPD meetings with cross functional teams.
- For building-in reliability & quality into NPD products, the reliability engineer gets involved in package & technology development, design of experiments (DOE), material and process characterization & validation & reliability evaluation & process and product qualifications… Results from these DOEs & process characterization & reliability evaluation will be employed to improve the quality and reliability of products.
- In case of failures happening during Qual stress tests, the engineer needs to perform 1st level reject disposition and failure analysis for reliability failures and teamwork with Product Engineer, Sub-con & Foundry, Packaging, Technology, and Design teams for root cause analysis and request corrective or preventive actions if applicable.
- Work closely with PE and TE to review the NPD test program development to ensure Test Quality in NPD process & release
- Participate in Product Validation Process and provide engineering inputs to improve NPD Quality & Reliability
- Participate in Product Yield Improvement Process and provide engineering inputs to improve NPD Yield& Quality & Reliability
- Lead the Qualification Readiness Check in the cross-functional areas
- Be responsible for working with PE on drift analysis of the Qualification tests, and electrical data analysis of the qualification rejects
- The engineer is to work with BE Ops, PKG/Assembly, and TE on Qualification of MP changes; to develop, document and to execute the reliability strategy and qualification plans for MP changes. Participate BE ops meetings with cross functional teams. Support Reliability functions for RMA customer returns.
- The job requires the engineer to participate in assessment of Qual Material Readiness and Test program readiness required to release qualification materials into qualification process. The engineer should write clear and complete Qual readiness report and risk assessments, and also reliability qualification reports.
- For NPD projects, the engineer is to work with Design, Technology, PI, PE, TE, and PKG to develop, to document and to execute the reliability strategy and qualification plans for new product development. Participate weekly NPD meetings with cross functional teams.
- For building-in reliability & quality into NPD products, the reliability engineer gets involved in package & technology development, design of experiments (DOE), material and process characterization & validation & reliability evaluation & process and product qualifications… Results from these DOEs & process characterization & reliability evaluation will be employed to improve the quality and reliability of products.
- In case of failures happening during Qual stress tests, the engineer needs to perform 1st level reject disposition and failure analysis for reliability failures and teamwork with Product Engineer, Sub-con & Foundry, Packaging, Technology, and Design teams for root cause analysis and request corrective or preventive actions if applicable.
- Work closely with PE and TE to review the NPD test program development to ensure Test Quality in NPD process & release
- Participate in Product Validation Process and provide engineering inputs to improve NPD Quality & Reliability
- Participate in Product Yield Improvement Process and provide engineering inputs to improve NPD Yield& Quality & Reliability
- Lead the Qualification Readiness Check in the cross-functional areas
- Be responsible for working with PE on drift analysis of the Qualification tests, and electrical data analysis of the qualification rejects
- The engineer is to work with BE Ops, PKG/Assembly, and TE on Qualification of MP changes; to develop, document and to execute the reliability strategy and qualification plans for MP changes. Participate BE ops meetings with cross functional teams. Support Reliability functions for RMA customer returns.
- The job requires the engineer to participate in assessment of Qual Material Readiness and Test program readiness required to release qualification materials into qualification process. The engineer should write clear and complete Qual readiness report and risk assessments, and also reliability qualification reports.
Qualifications:
- A minimum of a Bachelor's degree in an Engineering discipline. M.S. degree or Ph.D. is preferred.
- Minimum 8 years of Semiconductor Reliability Engineering or Product Engineering experience required.
- Knowledge of advanced reliability concepts & methodologies, NPD Process and Product Qualification flow/tests, Familiar with industrial standards (like JEDEC, IPC, AEC Q100)
- Experienced with MP Change Control Process & Qualification & PCN process.
- Experienced with leading and implementing reliability program strategies for new product development.
- Knowledgeable and experienced with CMOS devices physics, Device & Circuit Reliability, Design for Reliability, and familiar with reliability statistics & models.
- Knowledgeable and experienced with CMOS package, assembly process, semiconductor package failure modes;
- Provide engineering input to NPD cross functional teams to ensure reliable and robust products.
- Responsible for the successful completion of reliability deliverables into the company’s Product Development Process
- Experience with Product or Test Engineering, familiar with drift analysis of Qualification samples
- Experience with Failure Analysis for Qualification Failures
- Effective engineering analytical and problem solving skills.
- Effective oral and written communication skills; Effective meeting and presentation skills.
- Effective analytical and problem solving skills.
- Demonstrated ability to commit to assigned tasks.
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