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Salary
$20k – $42k per year (Estimated)
Location
In office (Carmona)
Seniority
Senior · 7+ years exp
Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.

Basic Purpose of the Job:

Provide the necessary support for project and program management, as well as the continual improvement of the onsemi Carmona Site. The objective of these activities is to help the site enhance performance, achieve excellent outcomes, and improve manufacturing and business operations to reduce costs and improve quality.

Reporting Relationship:

The position reports directly to Technical PMO Manager

Requirements:

  • Spearhead, lead, and support project champions in collaborating with cross-functional teams to align with KPI metrics and achieve targets.
  • Support the development of projects and programs to meet the goals of the Operational Excellence Department.
  • Lead and manage BOM-related projects and product development, including qualifying new suppliers and introducing cost-effective BOM and process types-from qualification and manufacturing validation to safe launch and mass production release.
  • Review engineering builds and complete assembly build requests, qualification reports, and production release documentation.
  • Provide support for all manufacturing requirements related to equipment and maintenance.
  • Perform other related project activities as assigned.
  • Demonstrate the ability to multi-task and organize work systematically to meet deadlines without compromising quality.
  • Support and improve wire bonding (WB) equipment and processes to enable device and platform proliferation and ensure product and process robustness.

Qualification:

Education and Experience

  • Minimum of seven years of direct experience in semiconductor operations.
  • Bachelor’s degree in Engineering (Mechanical, Electrical, Electronics, or Materials Science).
  • Extensive experience in New Product Engineering, with specific expertise in assembly processes. Knowledge of metallurgy and materials science is an advantage.

Skills

  • Specific Assembly Process expertise
  • Background on Program Management, Problem Solving Skills and Business Acumen and Strategic Thinking .
  • Excellent communication skills
  • Proficient in Microsoft Office
  • AutoCAD and 3D modelling is an advantage
  • Working knowledge of DOE / 6 Sigma Statistical Tools
  • Working knowledge on large scale, safe launch and pre-production releases
  • Working knowledge on Control Plan / FMEA, 8D and Problem Solving
  • Good interpersonal skills in collaborating with support groups
  • Highly motivated to work in a dynamic environment, with good integrity and character
  • Basic understanding of and ability to apply statistical analysis
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