Senior Post Fab Module Engineer (MOSFET)

We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY. This role is critical to our ability to improve device performance and drive best in class trenchMOSFET Technology as we develop new products and ramp volume manufacturing. Job role requires an Engineer who is ready to step in as a leader withing the Team and who has experience in wafer thinning, ultra-thin wafer handling, backside metallization, and managing stress and thermal effects on thinned wafers.

Responsibilities:

• Owns the process roadmap and module technology direction in EFK’s BGBM Post Fab.
• Sets process standards across tools and areas of our line as go-to expert with site-level authority to improve our manufacturability of our MOSFET and IGBT technologies in our Post Fab back-grind, back-metallization line.
• Owner of control plans, PFMEA and risk mitigation plans for thin wafers to enable robust high-volume manufacturing. Includes leading the scaling from development to high volume manufacturing to global replication.
• Evaluate and qualify new materials, processes, and equipment for our Post Fab back-end wafer operations.
• Troubleshoot process issues and implement corrective actions to improve yield and device performance.
• As Tool Owner lead tool matching and variation reduction; own process windows across multiple platforms, and interface directly with suppliers on tool roadmaps.
• Self-manage technical projects and provide technical team leadership to other Engineers in the organization.
• Communicate clear project plans and results to senior management.
• Collaborate with cross-functional teams including R&D, Quality, and Manufacturing to support new product introductions.
• Raise overall backend technical capability and influence engineering culture through the mentorship of multiple engineers in organization.
• Analyze process data and apply statistical methods to drive continuous improvement.
• Ensure compliance with safety and quality standards.

Education / Experience:

• Bachelor’s or higher degrees in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related degree.
• 10 years of direct work experience in the semiconductor industry with specific experience in back-end processing of wafers. Including experience with operations such as wafer thinning, Al/Ti/NiV/Ag backside metallization stacks, and managing stress and thermal effects on thinned wafers.

Skills:

• Strong understanding of semiconductor device physics and back-end wafer processes.
• Proficient in SPC, DOE, and data analysis tools.
• Demonstrated success in yield, throughput, and cost improvement initiatives.
• Proficient with structured problem-solving tools and how to apply them to lead improvement actions that result in positive technology and business outcomes.
• Familiarity with standard metrology, inspection, and failure analysis techniques.
• Ability to own, lead, and drive product development and technology improvement.
• Self-motivated, detail-oriented, and results-driven.
• Strong communication skills, both written and verbal, and a collaborative mindset.
• Ability to work effectively in a team and provide hands-on support and mentorship to other Engineering and Operations staff.

Salary: onsemi is excited to share the base salary range for this position is $127.800 to $217,200 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf