Team Leader, Advanced Packaging
At IQM, we build world-leading quantum computers for the well-being of humankind. We design systems to tackle computational challenges beyond the practical limits of classical machines. Our work sits at the edge of science and engineering. It's complex, demanding, and deeply collaborative. We turn deep research into reliable, full-stack systems that drive discoveries in fields like medicine, energy, and technology, reshaping how the world computes.
Join the team that gives quantum a heartbeat.
The work
As Team Leader, Advanced Packaging, you'll lead the team developing backend fabrication processes and advanced packaging technologies for next-generation QPUs. You own the interface between early-stage research, proof of concept, process engineering, and production: your job is to turn promising concepts into well-understood, reproducible, manufacturable processes that transfer cleanly into production.
You'll join QPU Development Engineering in Espoo, reporting to the Team Leader, QPU Development Engineering, and build up a new, dedicated backend and advanced packaging team. Day to day you'll work with Process Engineering, Equipment, Micro-packaging, Design, System Engineering, Measurement, Reliability, and Quality, alongside our research groups and the cleanroom and facilities teams.
This is leadership on two fronts at once: coaching experienced engineers, and setting technical direction, priorities, and cleanroom capacity calls. In your first six months, you'll have the team's development plan, milestones, and process-readiness criteria in place, and visible progress on the backend roadmap for the next generation's QPU packaging.
What you’ll actually do
Lead, coach, and develop the engineers working on backend fabrication, advanced packaging, and process integration
Set development priorities and allocate resources against QPU roadmaps, project needs, technical risk, and available cleanroom capacity
Drive technology maturation from research and proof of concept into robust, transferable fabrication processes
Define development plans, technical milestones, success criteria, and process-readiness expectations
Guide hypothesis-driven experiments, review results and technical conclusions with the team, and decide the next iteration
Keep development work data-based, traceable, and tied to QPU and product requirements: device performance, yield, reliability, scalability
Judge when a process is mature enough to hand to Process Engineering or Production, and make sure the transfer carries specifications, control plans, metrology methods, known limitations, and training
Identify and manage technical risks, process dependencies, blockers, and capability gaps before they stall the roadmap
Work across Research, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production to keep backend development aligned
Keep progress, priorities, risks, resource needs, and key decisions visible to your manager and stakeholders
What we’re looking for
A Master's degree in materials science, physics, electrical or chemical engineering, nanotechnology, microelectronics, or a related discipline
5+ years in semiconductor manufacturing, microelectronics, advanced packaging, quantum technologies, or comparable high-tech industry
2-3+ years leading technical teams, projects, or multidisciplinary engineering activities, with genuine coaching experience behind you
Hands-on backend process development and process integration experience, not oversight from a distance
A track record of taking technology from early phase to engineering or production readiness
Strong data-driven decision making and structured problem solving: experimental methods, process capability, root cause analysis
Stakeholder management and cross-functional collaboration, plus the ability to simplify complex technical topics for engineers, production, and senior management alike
Comfort deciding under uncertainty in a fast-moving R&D environment, and professional level English
Seen as an advantage
Cleanroom operations and safety leadership experience
Depth in specific advanced packaging technologies: flip-chip bonding, wafer-level packaging, through-silicon vias, or other fine-pitch integration
Experience building up a new team or function in a scaling organization
Familiarity with quantum computing, cryogenics, or other advanced hardware R&D
Why IQM?
Full-stack quantum computing: From quantum hardware to software layers and beyond, we build across the full-stack.
High-performance playground: We aim high, and we know sustainable performance only works when life outside work does too-hybrid setups, flexible hours.
Never the smartest: You won’t always be the smartest person in the room. Neither will we. Expect to learn constantly - from each other and beyond with IQM’s Learning Hub, LinkedIn Learning, and a team-based L&D budget.
Approachable leadership: Flat hierarchy, direct access. Feel free to approach any leaders. They're friendlier than they look!
The sweet spot: Big enough to matter. Small enough to move fast. Growing between a startup and a corporation. We’re in the phase where top performers get noticed.
Bigger than IQM: Our people build know-how for the entire quantum ecosystem. We publish papers, run hackathons, and help shape a market that's still being defined.
The future of computing won’t build itself. You might be one of the few who do.
Meet our people and learn more about IQM on ourstories page.
Explore ourscientific publications.
We'll start interviews and move forward with hiring as soon as we meet strong candidates. Please submit your application soon.
600M€+ Total Funding | 400+ Team Members | 30+ Quantum Computers Built | 300+ Patents Filed | 10 Location Globally