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Salary
≈ $38k – $96k per year (Estimated)
Location
In office (Bengaluru)
Seniority
Staff · 8+ years exp

Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on Sep 15, 2026. Qualcomm scores B on the Alion truth index.

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Qualcomm is an American semiconductor and wireless technology company founded in 1985 and headquartered in San Diego, California. It holds foundational patents in CDMA and the 3G, 4G and 5G cellular standards, licensing them to nearly every handset maker in the world, while its chip division designs the Snapdragon platforms that power a large share of Android smartphones, personal computers, wearables and connected cars. The company has been diversifying away from smartphone dependence into automotive digital cockpit and driver assistance systems, industrial internet of things, and on-device AI processing through its Hexagon and Oryon architectures.
Backed by NEA, Valueaddvc, Mayfield

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Software Applications Engineering

General Summary:

JOB OVERVIEW

This position is part of the Qualcomm Customer Engineering Group, which collaborates closely with automotive partners and customers - from concept through commercialization - across Qualcomm's broad Snapdragon Automotive platform portfolio. The team supports all aspects of embedded software including hardware and software architecture, feature bring-up, platform integration, software customization, system validation, and complex debugging efforts that are critical to product launch.

This is a Staff-level Software Applications Engineering position focused on Build & Integration (B&I) and Release Engineering for Qualcomm Snapdragon Automotive platforms. The primary mission of this role is to own, drive, and continuously improve build systems, integration pipelines, and release processes that enable automotive software delivery across IVI, ADAS, and FLEX segments for global automotive customers. The role spans multiple OS environments including Linux, Android, QNX (HQX), and HGY (Gunyah Hypervisor) with multi-OS virtualized stacks.

The successful candidate will serve as a Subject Matter Expert (SME) for Build & Integration engineering within the BDC CE team, driving cross-functional collaboration between Customer Engineering, Dev/Platform SW teams, and global automotive OEM/Tier-1 partners. As a Staff Engineer, this individual will provide technical leadership, mentor engineers, define build and release methodologies, and contribute to the continuous improvement of automation frameworks and engineering productivity tooling.

KEY RESPONSIBILITIES

Build, Integration & Release Management

  • Own and manage end-to-end build, integration, and release activities for complex Snapdragon Automotive software products spanning multiple OS platforms.
  • Design, implement, and maintain scalable and reliable build infrastructures and CI/CD pipelines tailored for embedded and HLOS automotive software stacks.
  • Drive continuous improvement of build systems, toolchains, automation frameworks, and release processes across program milestones.
  • Establish release governance, versioning, branching, tagging, and artifact management strategies for multi-OS automotive software deliveries.
  • Monitor build health, integration quality, and release readiness across multiple product streams and chipset generations.
  • Collaborate with development, quality engineering, and platform teams to ensure successful integration and deployment.
  • Identify bottlenecks and implement measures to improve build performance, reliability, and delivery efficiency.
  • Define and maintain build and release KPIs, dashboards, and operational metrics to track program health.
  • Ensure compliance with software development standards, security policies, and release governance processes.
  • Lead investigations and root-cause analysis for build failures, integration issues, and release blockers.

Triage & Engineering Support

  • Serve as the primary escalation point for build and integration-related issues across the Customer Engineering (CE) team.
  • Provide timely triage, troubleshooting, and resolution support for development, integration, and release issues.
  • Analyze build logs, compiler errors, dependency conflicts, toolchain issues, and deployment failures.
  • Drive root-cause analysis and corrective actions for recurring engineering issues; own Change Requests (CRs) end-to-end from triage through patch validation.
  • Partner with product, platform, and infrastructure teams to resolve cross-functional technical challenges.
  • Develop self-service tools, documentation, and best practices to improve engineering productivity across the BDC CE team.
  • Track and manage technical debt associated with build environments, toolchains, and integration workflows.

Customer Engagement & Technical Support

  • Serve as a key technical interface for build and integration queries from automotive OEM and Tier-1 customers across regions.
  • Support Automotive RFI (AutoRFI) assessments for B&I-related NRE scoping, communicating technical complexity and resource requirements.
  • Engage with customers during bring-up, pre-CS, and post-CS phases to proactively identify and mitigate build and integration risks.
  • Provide on-site customer support as required during critical program milestones.
  • Collaborate with NA, EU, and India CE teams to ensure global follow-the-sun build and integration support.

Automation, Tools & Engineering Productivity

  • Drive development and validation of build and release automation frameworks for multi-OS automotive software platforms.
  • Design and maintain automated build health monitors, integration quality dashboards, and triage tooling to reduce mean time to resolution.
  • Partner with platform and APT (Automated Platform Test) teams to define and integrate build qualification checks across CI/CD pipelines.
  • Create and maintain build guides, integration runbooks, and reusable diagnostic artifacts for build and release issues across platforms.
  • Track and analyze build and integration trends across program stages (Bringup → ES → L0-L4 → FC → CS) and communicate risk to program and customer teams.
  • Contribute to secure software supply chain and DevSecOps practices within the automotive software delivery pipeline.

Technical Leadership & Mentorship

  • Serve as the B&I SME for the BDC CE team, providing architectural guidance on build system design, integration strategy, and release engineering.
  • Lead cross-functional B&I reviews with Dev, QA, DevOps, and CE teams; drive root-cause analysis delivery to enable process improvements.
  • Mentor junior and mid-level engineers on build system concepts, CI/CD best practices, scripting, and customer engagement.
  • Influence feature design and architecture decisions to proactively prevent build and integration failures in future Snapdragon Automotive SPs.
  • Scale technical knowledge through reusable documentation, training materials, and knowledge-base contributions.

MINIMUM QUALIFICATIONS

Education & Experience

  • One of the following:
  • B.E. / B.Tech in Engineering, Computer Science, Electronics, or related field with 8+ years of Software Applications Engineering, Embedded Systems, or related experience.
  • M.Tech / M.S. in relevant field with 6+ years of experience.
  • Ph.D. in relevant field with 4+ years of experience.

Required Technical Skills

  • 5+ years of hands-on experience in build, integration, and release engineering for large-scale software products.
  • Strong expertise in CI/CD pipeline design, implementation, and optimization.
  • Hands-on experience with build automation systems (Make, CMake, Bazel, Ninja, Gradle, or similar).
  • Proficiency in scripting languages: Python, Shell/Bash for build and automation workflows.
  • Strong expertise in source control management and branching strategies (GitFlow, Trunk-Based Development).
  • Experience with artifact repository management and release artifact governance.
  • Experience with Linux/Unix build environments and containerized build infrastructure.
  • 3+ years of customer-facing or cross-functional technical support experience.
  • Strong written and verbal communication skills, with demonstrated ability to document RCAs and communicate technical findings to cross-functional teams.

PREFERRED QUALIFICATIONS

  • Staff-level experience owning build and integration engineering for production automotive programs (IVI / ADAS / FLEX) from bringup through SOP.
  • Experience with multi-OS build environments spanning Linux, Android, QNX (HQX), and HGY (Gunyah Hypervisor).
  • Familiarity with Qualcomm Snapdragon Automotive chipsets across Gen3 / Gen4 / Gen4.5 / Gen5 software delivery pipelines.
  • Experience with DevSecOps practices and secure software supply chain management.
  • Knowledge of containerization (Docker) and cloud-native build pipelines for embedded software.
  • Familiarity with ASPICE process compliance, ASIL functional safety considerations, and automotive program delivery cycles.
  • Experience with AutoRFI processes, NRE scoping, and CDEV (Chipset Development) activities within CE programs.
  • Knowledge of build and release KPI frameworks, dashboards, and workload-based productivity trend analysis.
  • Proven experience collaborating with global automotive OEM and Tier-1 customers on build, integration, and release escalations.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 4+ years of Software Applications Engineering, Software Development experience, or related work experience.

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 3+ years of Software Applications Engineering, Software Development experience, or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Applications Engineering, Software Development experience, or related work experience.

  • 2+ years of experience with Programming Language such as C, C++, Java, Python, etc.

• 1+ year of experience with debugging techniques.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.

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