Engineering Director - AI/Wireless Module Design

Company:

Qualcomm China

Job Area:

General Summary:

The QC module design team is looking for a candidate in a leadership role, who will lead a team of engineers consisting of RF design engineers, baseband design engineers, software engineers and test engineers to design next generation of AI modules and 5G/6G modules for applications from robotics, IOT devices, automobile control, and industrial automation.

Main responsibilities:

• Work with all business units within QC to take ill-defined product requirements and then make proposals for various products with cost and time-to-market considerations, with a goal of putting the product on the market with the shortest design cycle and the least cost.
• To identify, define, and conduct research on future module improvements from thermal mitigations, miniaturizations, and performance enhancements.
• Lead the team to stay ahead of competition and constantly find ways to improve our products

Requirements:

• Bachelor’s degree and above in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
• 15+ years of design experience of wireless products, solid RF and BB debug skills, and experience of design for manufacturing.
• Solid hardware design experience from concept to mass production, with comprehensive understanding of RF design, BB design, and mobile phone SW working knowledge.
• Be able to direct the team to work with CAD, ME, and PDN/PSIG engineers to design compact modules, and work with certification team to ensure the products pass various regulatory certifications.
• Team leading experience in a diversified global team.

Minimum Qualifications:

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

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