Senior Staff Engineer, Data Center Interconnect Standards & Ecosystem

Company:

Qualcomm China

Job Area:

General Summary:

We are seeking a Senior Staff Engineer to drive Qualcomm’s standards, ecosystem, and industry engagement activities in AI infrastructure and data center interconnect technologies. The role spans scale-up, scale-out, scale-across, and die-to-die connectivity, covering high-speed SerDes, protocol architectures, electrical and optical interconnects, and emerging chiplet technologies. Knowledge of advanced packaging and optical integration is highly desirable.

Key Responsibilities

• Represent Qualcomm in relevant standards organizations and industry forums, including ODCC, CCSA, GCC, OCTC, NIDA, and other data center and AI infrastructure initiatives.
• Drive technical analysis, standards development, technical contributions, white papers, interoperability activities, and ecosystem alignment for next-generation interconnect technologies.
• Track and influence scale-up, scale-out, scale-across, Ethernet/RDMA, PCIe/CXL, UCIe and other die-to-die or accelerator interconnect technologies.
• Analyze interconnect protocol stacks from SerDes and PHY through link and upper-layer protocol logic, including trade-offs in bandwidth, latency, power, reach, reliability, scalability, and cost.
• Evaluate copper and optical connectivity options, including board and backplane channels, copper cables, optical modules, CPO, NPO, silicon photonics, and optical I/O.
• Engage with hyperscalers, cloud providers, telecom operators, semiconductor and system vendors, research institutes, and industry organizations to align technical directions and identify collaboration opportunities.
• Work with internal architecture, engineering, product, standards, business development, and government affairs teams to develop company positions and provide technical recommendations.

Required Qualifications

• BS/MS in Electrical Engineering, Computer Engineering, Computer Science, Communications Engineering, Microelectronics, or a related field.
• 8+ years of relevant experience in data center networking, high-speed interconnects, SerDes, networking or switch silicon, AI infrastructure, chiplet technologies, or system architecture.
• Strong understanding of high-speed interconnects across PHY, link, and protocol layers, with hands-on knowledge in at least one core area such as SerDes, Ethernet/RDMA, PCIe/CXL, UALink/OISA/CLink/NVLink/UB, UCIe etc.
• Understanding of copper and optical transmission media, channel characteristics, and deployment trade-offs.
• Working knowledge of servers, racks, supernodes, AI clusters, and the communication requirements of large-model training and inference.
• Basic understanding of AI operators, collective communications, software stacks, and hardware/software development workflows.
• Experience with standard organizations, industry alliances, or cross-company technical collaboration.
• Strong technical writing, presentation, stakeholder management, and communication skills in both Mandarin and English.

Preferred Qualifications

• Knowledge of advanced packaging, including 2.5D integration, 3D stacking, silicon interposers, hybrid bonding, and HBM integration.
• Familiarity with CPO, NPO, silicon photonics, optical I/O, optical modules, and related thermal, power, reliability, and serviceability considerations.
• Established relationships with key participants in China’s data center ecosystem, including hyperscalers, cloud providers, telecom operators, research institutes, and standards or industry organizations.
• Proven ability to drive cross-company technical alignment, interoperability initiatives, and ecosystem collaboration.

Minimum Qualifications:

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years Software Engineering, Hardware Engineering, Systems Engineering, or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years Software Engineering, Hardware Engineering, Systems Engineering, or related work experience.

*Global travel several times per year for standards organization forums.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.