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Lead/Principal Semiconductor Packaging Engineer - 843

Quantinuum • Russian • Semiconductor Manufacturing • Quantum Science & Computing • Bachelor's Degree • Nationals only • 5 months ago
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Salary
$137k – $218k per year
Location
In office (Malta, Malta)
Seniority
Principal · 10+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 24, 2026. First seen by Alion on May 18, 2026. Quantinuum scores B on the Alion truth index.

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Quantinuum

Headquartered in Broomfield, Colorado, Quantinuum is a full-stack quantum computing company formed through the merger of Honeywell Quantum Solutions and Cambridge Quantum. The firm develops trapped-ion quantum hardware alongside specialized software platforms, including quantum chemistry engines, compiler toolkits, and quantum-cybersecurity applications.
quantinuum.com • HQ: Broomfield, United States • Quantum Science & Computing • Quantum Computing Hardware • 501-1000 employees • Est. 2021
Tech stack of Quantinuum
Backed by Silicon Valley Investclub, QED Investors, Owl Ventures

We are seeking an experienced Lead/Principal Semiconductor Packaging Engineer to work on a supplier site in Malta, NY as a full time Quantinuum employee developing innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers.

All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.

Key Responsibilities:

  • Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together
  • Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density
  • Generate packaging requirements for mechanical, thermal, electrical, and optical performance
  • Lead a team working with vendors to implement and validate packaging processes
  • Support all stages of ion trap development to ensure compatibility with packaging
  • Lead a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
  • Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities

YOU MUST HAVE:

  • Minimum Bachelor’s degree with 10+ years’ experience OR Master’s degree with 8+ year’s experience OR PhD with 6+ year’s experience in advanced semiconductor packaging development
  • Experience with 2.5-3D packaging techniques
  • Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
  • Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

WE VALUE:

  • PhD in Physics or Engineering
  • Experience with advanced large area multi-chip semiconductor packaging technologies
  • Experience with large heterogeneous integration
  • Experience with high-density I/O technologies
  • Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling
  • A proven track record of innovation and IP development
  • Experience working within a cross-functional team environment
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