Failure Analysis Engineer

Job Req ID: 29047

About Supermicro:

Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are the #5 fastest growing company among the Silicon Valley Top 50 technology firms. Our unprecedented global expansion has provided us with the opportunity to offer a large number of new positions to the technology community. We seek talented, passionate, and committed engineers, technologists, and business leaders to join us.

Essential Duties and Responsibilities:

• Participate in the repair of production defective PCBA boards, following established procedures and guidance.
• Response for failure analysis activities and repair machine (ex. BGA machine, tooling…etc) for defective boards. Collaborate with R&D on critical non-conformance (NG) symptoms were required.
• Response for preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
• Perform other related duties or technical support tasks as assigned by the supervisor, based on operational needs.
• Support NPI build activities, including basic debugging, analysis, and repair of defective boards, as part of cross-functional support.
• Work closely with the product engineering team to identify and resolve production-related issues, including those arising from SMT and PCBA assembly processes.
• Exposure to PCBA schematics, test points, and debugging tools (e.g., multimeter, oscilloscope) will be an added value.
• Familiarity with SMT processes, soldering, rework techniques, or IPC standards is preferable and considered an advantage to the candidate.
• Ability or willingness to support NPI ramp-up activities, pilot runs, or engineering builds is desirable.
• Willingness to learn and adapt to new products, technologies, and repair methodologies is viewed as an added value.
• Ability to perform effectively under pressure and meet work demands.
• Willingness to support company assignments, including overtime and overseas travel (e.g., the U.S., Taiwan) for short-term missions of up to one (1) month.

Qualifications:

• Bachelor’s degree or higher in Electrical Engineering (BSEE), Mechanical Engineering (BSME), or a related field, with at least 3~5 years of repair experience in the PCBA industry.
• Excellent communication and interpersonal skills, with the ability to collaborate effectively across departments and with external stakeholders, including customers.
• Working knowledge or exposure to computer or server operations and common electronic components or devices is preferable and considered an advantage to the candidate.
• Basic understanding of electronic circuit fundamentals is desirable and viewed as an added value.
• Experience or familiarity with soldering and desoldering techniques is preferred; exposure to BGA rework will be an added advantage.
• Understanding or hands-on exposure to computer or server testing and inspection processes is preferable.
• Comfortable operating common software environments such as Windows; basic exposure to Linux is considered an added value.
• Ability to support electronic circuit analysis and troubleshooting activities, under guidance when required, is desirable.
• Demonstrates teamwork, self-motivation, and a positive working attitude, with the willingness to contribute to team objectives and continuous improvement.
• Experience with Fortune 500 EMS/ODM/OEM electronics manufacturing companies is highly preferred but not necessary.

EEO Statement