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Location
In office
Seniority
Staff · 5+ years exp
Overview
Company
Impact
Profile match
Synopsys (NASDAQ: SNPS) is a premier American multinational technology corporation and the global leader in Electronic Design Automation (EDA), semiconductor intellectual property (IP), and software security and quality solutions. Headquartered in Sunnyvale, California, and led by CEO Sassine Ghazi, Synopsys operates on a B2B enterprise software, proprietary semiconductor IP licensing, and silicon engineering services model.

Job Description and Requirements

We Are

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You have spent years in the trenches of power delivery, where a poorly placed decap or a miscalculated target impedance can tank an entire PHY bring-up. The difference between a clean power rail and one that introduces jitter into a multi-gigabit link is something you see in your sleep, and you know how to catch it before tape-out. You think in frequency domains and transient responses, not buzzwords.

Working across die, package, and board does not intimidate you because you have done it enough times to know where the handoffs break and how to keep them from breaking again. You speak the language of PHY designers, package engineers, and board layout teams equally well, translating target impedance into via counts and decoupling strategies without losing anyone in the process. You do not wait for perfect schematics or final stackups. You model what you have, flag what is missing, and move the design forward.

At Synopsys, you will work on UCIe PHY and chiplet architectures that are defining the next generation of heterogeneous integration. The problems are hard, the stakes are real, and what you optimize will ship in systems that matter.

What You'll Be Doing

  • Lead end-to-end power integrity analysis across die, package, and PCB for UCIe PHY and high-speed I/O systems, from VRM to on-die power grid
  • Develop and optimize Power Delivery Network architecture, performing DC IR drop, AC impedance, transient response, and resonant analysis
  • Build and validate electrical models for silicon, package substrates, PCBs, decoupling capacitors, and voltage regulators using S-parameters, IBIS, and SPICE
  • Define target impedance requirements and analyze simultaneous switching noise, ground bounce, and power-induced jitter
  • Collaborate with package, PCB, signal integrity, and PHY teams to optimize decoupling strategies and power distribution topologies
  • Support silicon bring-up by correlating lab measurements with simulation results and refining models for future designs

The Impact You Will Have

  • Enable next-generation UCIe PHY performance by delivering clean, reliable power to multi-gigabit interfaces in chiplet-based systems
  • Define power integrity methodology and sign-off criteria that will be reused across future high-speed I/O platforms at Synopsys
  • Reduce design respins and time-to-market by catching power delivery issues early through rigorous simulation
  • Drive the success of AI and HPC accelerator products by ensuring power integrity in advanced 2.5D and 3D IC packaging technologies
  • Improve PI analysis efficiency across the team by developing automation scripts and reusable simulation frameworks
  • Shape design guidelines for die-package-board co-design that will influence Synopsys IP roadmaps

What You'll Need

  • Master's or Ph.D. in Electrical Engineering with 5+ years of hands-on experience in Power Integrity or high-speed interface design
  • Deep understanding of Power Delivery Network design, including DC IR drop, AC impedance, transient analysis, and resonance mitigation
  • Proven experience with die-package-board co-design for high-speed interfaces such as UCIe, PCIe, DDR, SerDes, or HBM
  • Proficiency with PI tools such as Cadence Sigrity, Ansys SIwave, Ansys HFSS, Ansys RedHawk-SC, Keysight ADS, or PowerSI
  • Strong working knowledge of S-parameters, IBIS/IBIS-AMI modeling, SPICE simulation, and frequency-domain analysis
  • Scripting experience in Python, Tcl, or MATLAB for automation and data analysis

Who You Are

  • You can translate between PHY designers and package engineers without losing technical accuracy
  • When a simulation result does not match your intuition, you dig into the model assumptions rather than accepting the number
  • You approach problems methodically but know when to pivot quickly, especially when a design decision is blocking downstream work
  • You stay organized across multiple concurrent analyses, keeping track of which simulations are running and which results need communication
  • You correlate lab data with simulation not to prove you were right, but to make the next model better

The Team You'll Be Part Of

You will join the high-speed I/O and UCIe PHY development team in Da Nang, working on next-generation chiplet-based systems and advanced heterogeneous integration. This team delivers power and signal integrity solutions that enable Synopsys IP to meet the performance demands of AI, HPC, and high-speed interconnect applications.

Rewards and Benefits

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

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