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Location
In office (Bengaluru)
Seniority
Senior · 5+ years exp
Visa
Sponsors visas in United States; no register of this country names it

Confirmed on the employer's own hiring board on Nov 15, 2026. First seen by Alion on Mar 31, 2026. Texas Instruments scores B on the Alion truth index.

Overview
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Texas Instruments is an American semiconductor company headquartered in Dallas, Texas, that designs and manufactures analog chips and embedded processors. Its history goes back to Geophysical Service, founded in 1930, and TI engineer Jack Kilby built the first integrated circuit in 1958. Most of its revenue comes from industrial and automotive customers, and it makes most of its chips in its own wafer fabs in Texas and Utah. It is listed on Nasdaq.

About Ultra-Wide-Band (UWB):

Ultra-Wide-Band (UWB) is an emerging high growth Connectivity technology. Short pulses <3>

About RF Transceiver Group in Connectivity:

Texas Instruments RF Connectivity group is expanding their RF Transceiver Design group. This group develops cutting edge RF Transceiver products (+MCU integrated) for Wireless-LAN (WIFI) and Ultra-Wideband Systems (UWB). The candidate will join in the UWB Design group. Candidate gets to experience Block Architecture Phase, Concept Design and take the design through the various design phases such as Schematic, Layout, Extracted simulations and Test and Verification. The role is primarily in Analog/RF class of circuit design to meet the overall System & Product requirements. The typical blocks include RF blocks such as LNA, TA, Down-conversion Mixers, Base-band filters, High Speed ADC to send data to the Modem. Reverse Chain namely for Transmitter, starting from DAC, Base-band filter, Up-conversion mixer and Power Amplifier stages to drive the TX Pin. LO system design including Chrystal Oscillator, integer/fractional PLL and LO Distribution systems. Various Calibration modules (AGC, PDET, Gain, Offset, IQMM, etc) to calibrate the Transceiver chain is part of the design. Low Current Mode and Complex Power Management to operate at low LDO input voltage etc. The Design Engineer in RF Connectivity gets introduced to a Holistic view of the product including, Radio Silicon Design, Packaging and PCB and solution design.

About the Role:

We are hiring one lead level IC Design Engineer with demonstrated design cycle experience. Some of the possible roles are:

  • PLL & Clock System Design
  • IF filter and VGA Design
  • Transmitter Design

Candidate should have gone through 1 complete design cycle of an RF transceiver: namely Architecture, Schematic Design, Layout Design, Tape Out, Test & Validation and identifying design fixes for subsequent Tape Out.

Minimum requirements:

  • Bachelor's degree in Electrical Engineering
  • 5 years of relevant experience
  • Candidate should have gone through 1 complete design cycle of an RF transceiver: namely Architecture, Schematic Design, Layout Design, Tape Out, Test & Validation and identifying design fixes for subsequent Tape Out.

Preferred qualifications:

  • Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
  • Strong verbal and written communication skills
  • Ability to quickly ramp on new systems and processes
  • Demonstrated strong interpersonal, analytical and problem-solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery
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