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Salary
$88k – $169k per year (Estimated)
Location
In office (Austin)
Seniority
Senior · 5+ years exp
Employment
Full-Time
Overview
Company
Impact
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The University of Texas at Austin is the flagship campus of the University of Texas System, opened in 1883 and now one of the largest public research universities in the United States. It enrols around fifty thousand students across colleges covering engineering, natural sciences, business, liberal arts, law, computer science and communications, and it operates major research units including the Texas Advanced Computing Center and the Oden Institute for computational engineering. Located in Austin, it is funded partly through the Permanent University Fund built on oil and gas revenue from state land, and it employs tens of thousands of academic and support staff.

Job Posting Title:

Thermal Mechanical Modeling Engineer, Texas Institute for Electronics

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Hiring Department:

Texas Institute for Electronics

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Position Open To:

All Applicants

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Weekly Scheduled Hours:

40

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FLSA Status:

To Be Determined at Offer

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Earliest Start Date:

Ongoing

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Position Duration:

Expected to Continue

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Location:

AUSTIN, TX

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Job Details:

General Notes

About Us

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin - named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report - the Texas Institute for Electronics embodies the city’s innovative spirit.

UT Austin, recognized by Forbes as one of America’s Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

  • Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
  • Voluntary Vision, Dental, Life, and Disability insurance options
  • Generous paid vacation, sick time, and holidays
  • Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
  • Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
  • Flexible spending account options for medical and childcare expenses
  • Robust free training access through LinkedIn Learning plus professional conference opportunities
  • Tuition assistance
  • Expansive employee discount program including athletic tickets
  • Free access to UT Austin's libraries and museums with staff ID card
  • Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
  • For more details, please see Benefits | Human Resources and UT Austin Employee Experience | Human Resources and UT Austin Employee Experience | Human Resources

Must be eligible to work in the United States on a full-time basis for any employer without sponsorship.

Purpose

This role is to lead and execute comprehensive thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Responsibilities

  • Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
  • Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
  • Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
  • Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains.
  • Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
  • Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
  • Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
  • Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
  • Other related functions as assigned.

Required Qualifications

Engineer:

  • BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
  • 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
  • Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
  • Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
  • Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
  • You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
  • Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
  • Location. Austin, Texas is required for close collaboration with our engineering teams and partners.

Senior Engineer:

  • MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
  • 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
  • Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
  • Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.

Preferred Qualifications

Engineer/Senior Engineer:

  • Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
  • Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
  • Demonstrated experience creating and validating PDK/ADK simulation collateral spanning thermal, and mechanical domains.
  • Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.

Salary Range

TIE Pays Industry Competitive Salaries

Working Conditions

  • Uniforms and/or personal protection equipment (furnished)
  • May work in all weather conditions
  • May work in extreme temperatures
  • May work around chemical fumes
  • May work around standard office conditions
  • May work around biohazards
  • May work around chemicals
  • May work around electrical and mechanical hazards
  • Repetitive use of a keyboard at a workstation
  • Use of manual dexterity (ex: using a mouse)
  • Climbing of stairs
  • Climbing of ladders
  • Lifting and moving 30 pounds

Work Shift

  • Monday - Friday
  • Occasional nights/weekends required

Required Materials

  • Resume/CV
  • 3 work references with their contact information; at least one reference should be from a supervisor
  • Letter of interest

Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.

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Employment Eligibility:

Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University-Wide or Open Recruiting, to include both promotional opportunities and lateral transfers. Staff who are promotion/transfer eligible may apply for positions without supervisor approval.

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Retirement Plan Eligibility:

The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length. This position has the option to elect the Optional Retirement Program (ORP) instead of TRS, subject to the position being 40 hours per week and at least 135 days in length.

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Background Checks:

A criminal history background check will be required for finalist(s) under consideration for this position.

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Equal Opportunity Employer:

The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.

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Pay Transparency:

The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor’s legal duty to furnish information.

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Employment Eligibility Verification:

If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.

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E-Verify:

The University of Texas at Austin use E-Verify to check the work authorization of all new hires effective May 2015. The university’s company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following:

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Compliance:

Employees may be required to report violations of law under Title IX and the Jeanne Clery Disclosure of Campus Security Policy and Crime Statistics Act (Clery Act). If this position is identified a Campus Security Authority (Clery Act), you will be notified and provided resources for reporting. Responsible employees under Title IX are defined and outlined in HOP-3031.

The Clery Act requires all prospective employees be notified of the availability of the Annual Security and Fire Safety report. You may access the most recent report here or obtain a copy at University Compliance Services, 1616 Guadalupe Street, UTA 2.206, Austin, Texas 78701.

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