Ethernet Scale - Up RTL Lead / Principal Engineer

About TYLsemi, Inc.

The Opportunity

The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?

That's what we solve. TYLsemi builds the chiplet infrastructure IP - the IO, power delivery, and interconnect building blocks - that makes AI/HPC systems actually work at scale.

This isn't a nice-to-have. It's the critical path.

Why Now

The Market Window

The semiconductor industry is going through its biggest architectural shift in 40 years:

• Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.
• Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI - they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually.
• IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.
• Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing.

Culture & Team: How We Work

No Politics, No Bureaucracy

There are no layers, no approval chains, no corporate theater.

• If you have an idea, we test it. If it works, we ship it.
• No endless meetings, no PowerPoint presentations to convince middle management.

Remote-Friendly, Global Team

• US team: Bay Area preferred, but we hire the best people regardless of location
• India team: Building a world-class design center in Bangalore

Move Fast, Ship Real Products

We're not a research project. We have paying customers, committed capital, and aggressive timelines.

This is a company, not a lifestyle business. We're building to win.

What We Value

• Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it.
• Bias for action. We move fast. Analysis paralysis doesn't fly here.
• Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware.
• Low ego, high standards. We don't care about titles or politics. We care about results.

The Ask

If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.

We're asking you to walk away from that and bet on us.

Here's why you should:

• The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building.
• The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo.
• The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.
• The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI.

This is the bet. Join us and build something that matters.

Or stay comfortable. No judgment.

But if you're the kind of person who wants to take the shot, we'd love to talk.

READY TO JOIN?

Role Overview

TYLsemiis developingpurpose-built connectivity chiplet for HPC/rack-scale AI systems. We are seeking a Principal Engineer Ethernet Scale-up tolead the architecture and design of next-generationEthernet Scale-Up Networking (ESUN) solution. This is a high-impact technical role.

What You'll Do

• Define architecture for Ethernet-based AI scale-upinterconnects andaccelerator fabrics.

• Lead development of high-performanceEthernet Subsystemmicroarchitectures including RDMA, packet processing,network offload,traffic management, congestion control, and reliability mechanisms.

• Drive execution from architecture through RTL, verification, physical design, silicon bring-up, and production.

• Optimizeperformance, latency, scalability, power, and reliability for demanding AI and HPC workloads.

• Collaborate across hardware, firmware, software, and system teams to deliver industry-leading AI networking solutions.

• Serve as a company-wide technical leader, influencing product strategy, roadmap, and architectural direction.

What We're Looking For

• 15+ years of ASIC/SoC architecture and design experience.

• Proventrack recorddelivering networking, NIC, switch, DPU, accelerator interconnect, or high-speed connectivity silicon.

• DeepexpertiseinSystemVerilog/RTL design and high-performancedatapatharchitecture.

• Strong knowledge of Ethernet, RDMA, traffic management, congestion control, and scalable fabric architectures.

• Experience across the full ASIC lifecycle, from architecture toproductionsilicon.

Good to Have

• Ultra Ethernet,UALink, RoCEv2, InfiniBand

• PCIe Gen6/Gen7, UCIe, CXL

• AI/HPC interconnects and collective communication acceleration

• 400G/800G/1.6T Ethernet systems

• High-speed SerDes and advanced networking architectures

Success in This Role Looks Like

• Ethernet Scale-Up Networking architecture is defined and validated for next-gen HPC/rack-scale AI systems, with clear technical direction across accelerator fabrics.
• High-performance Ethernet subsystem microarchitecture (RDMA, packet processing, offload, traffic management, congestion control) is delivered on schedule and meets production-quality reliability bars.
• Programs move cleanly from architecture through RTL, verification, physical design, and silicon bring-up with minimal rework.
• Performance, latency, power, and reliability targets are met or exceeded for demanding AI/HPC workloads.
• Cross-functional teams (hardware, firmware, software, systems) are aligned and unblocked, with this role recognized as a trusted technical authority shaping product strategy and roadmap.